C8051T606ZDB Silicon Laboratories Inc, C8051T606ZDB Datasheet - Page 25

• Manufacturer Part Number: C8051T606ZDB
• Description: CARD DAUGHTER QFN10 SOCKET
• Manufacturer: Silicon Laboratories Inc

Specifications of C8051T606ZDB

• Module/board Type: Socket Module - QFN
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051T606
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1668

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
C1
E
mask and the metal pad is to be 60 m minimum, all the way around the pad.
to assure good solder paste release.
Body Components.
Figure 5.2. SOIC-14 Recommended PCB Land Pattern
Table 5.2. SOIC-14 PCB Land Pattern Dimensions
5.30
Min
1.27 BSC
Max
5.40
Rev. 1.2
Dimension
C8051T600/1/2/3/4/5/6
X1
Y1
0.50
1.45
Min
1.55
Max
0.60
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