C8051T610DB28 Silicon Laboratories Inc, C8051T610DB28 Datasheet - Page 28
C8051T610DB28
Manufacturer Part Number
C8051T610DB28
Description
DAUGHTER BOARD T610 28QFN SOCKET
Manufacturer
Silicon Laboratories Inc
Datasheet
1.C8051T610DB32.pdf
(218 pages)
Specifications of C8051T610DB28
Module/board Type
Socket Module - QFN
Processor To Be Evaluated
C8051T61x
Interface Type
USB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
C8051T610DK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
336-1506
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Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 3x3 array of 0.90mm openings on a 1.1mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60m minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume.
Small Body Components.
Figure 5.2. QFN-28 Recommended PCB Land Pattern
Table 5.2. QFN-28 PCB Land Pattern Dimesions
0.20
Min
4.80
4.80
0.50
Max
0.30
Rev 1.0
Dimension
X2
Y1
Y2
3.20
0.85
3.20
Min
Max
3.30
0.95
3.30
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