KIT15XS3400EVBE Freescale Semiconductor, KIT15XS3400EVBE Datasheet - Page 42

• Manufacturer Part Number: KIT15XS3400EVBE
• Description: BOARD EVALUATION FOR 5XS3400
• Manufacturer: Freescale Semiconductor
• Type: MOSFET & Power Driverr

Specifications of KIT15XS3400EVBE

• Main Purpose: Automotive Lighting
• Embedded: No
• Utilized Ic / Part: MC15XS3400
• Primary Attributes: Four low RDS(ON) MOSFETs
• Secondary Attributes: Temperature Protection
• Interface Type: SPI
• Product: Power Management Modules
• Silicon Manufacturer: Freescale
• Silicon Core Number: MC15XS3400
• Kit Application Type: Power Management
• Application Sub Type: EXtreme Switch
• Kit Contents: Board, CD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: 15XS3400

package intended to be soldered directly on the printed circuit
board.
standards J-STD-020C Sn-Pb reflow profile. The maximum
peak temperature during the soldering process should not
exceed 245 for 10 seconds maximum duration.
42
15XS3400
PACKAGING
SOLDERING INFORMATION
The 15XS3400 is packaged in a surface mount power
The CPNA code was qualified in accordance with JEDEC
For the most current package revision, visit www.freescale.com and perform a keyword search using the 98ARL10596D listed below.
SOLDERING INFORMATION
PACKAGE DIMENSIONS
NONLEADED PACKAGE
PACKAGING
98ARL10596D
24-PIN PQFN
PNA SUFFIX
ISSUE D
standards J-STD-020C Pb-free reflow profile. The maximum
peak temperature during the soldering process should not
exceed 260 for 40 seconds maximum duration.
design and assembly.
The DPNA code was qualified in accordance with JEDEC
The AN2469 provides guidelines for Printed Circuit Board
Analog Integrated Circuit Device Data
Freescale Semiconductor