NCP2809AEVB ON Semiconductor, NCP2809AEVB Datasheet - Page 21

• Manufacturer Part Number: NCP2809AEVB
• Description: EVAL BOARD FOR NCP2809A
• Manufacturer: ON Semiconductor
• Series: NOCAP™r

Specifications of NCP2809AEVB

• Design Resources: NCP2809AEVB BOM NCP2809AEVB Gerber Files NCP2809AEVB Schematic
• Amplifier Type: Class AB
• Output Type: Headphones, 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 135mW x 2 @ 16 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Board Type: Fully Populated
• Utilized Ic / Part: NCP2809
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: NCP2809A
• Other names: NCP2809AEVBOS

How to Optimize the Accuracy of VMC
audio amplifier is the use of a virtual ground that allows
connecting directly the headset on the outputs of the device
saving DC−blocking output capacitors. In order to have the
best performances in terms of crosstalk, noise and supply
current, the feedback connection on the virtual ground
amplifier is not closed internally. To reach this goal of
excellence, one must connect OUT_I and REF_I as close
as possible from the middle point of the output jack
connector. The most suitable place for this connection is
directly on the pad of this middle point.
Table 1. Bill of Material − Micro10
Table 2. Bill of Material − UDFN10
The main innovation of the NCP2809 stereo NOCAP
Item
Item
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
NCP2809 Audio Amplifier
SMD Resistor 100 KW
Ceramic Capacitor 390 nF 50 V Z5U
Ceramic Capacitor 1.0 mF 16 V X7R
Optimized Performance
Tantalum Capacitor 220 mF 10 V
I/O Connector. It can be plugged by
BLZ5.08/2 (Weidmüller Reference)
I/O Connector. It can be plugged by
BLZ5.08/3 (Weidmüller Reference)
3.5 mm PCB Jack Connector
Jumper Header Vertical Mount
2*1, 2.54 mm
Stereo Headphone Amplifier
Thick Film Chip Resistor
Ceramic Chip Capacitor
PCB Header, 2 Poles
SMB Connector
3.5 mm PCB Jack Connector
Short Connector
Short Connector
Part Description
Part Description
C1,C2,C5,C7
J1,J2,J8
J14,J15
J24,J25
R1−R5
Ref.
U1
U2
J5
PCB LAYOUT GUIDELINES
http://onsemi.com
C9,C10
C2,C4,
C1,C3,
J4,J10
U1,U3
R1,R2
C6,C8
C5,C7
U2,U4
J2,J3,
J8,J9
J1,J7
PCB Footprint
Ref.
UDFN10 3x3
21
0805
0805
NA
NA
NA
NA
NA
How to Optimize THD+N Performances
traces of the power supply, ground, OUT_R, OUT_L and
OUT_I need the lowest resistance. Thus, the PCB traces for
these nets should be as wide and short as possible.
traces parallel to each other. Due to its internal structure,
the amplifier can be sensitive to coupling capacitors
between Ground and each output (OUT_R, OUT_L and
OUT_I). Avoid running the output traces between two
ground layers or if traces must cross over on different
layers, do it at 90 degrees.
To get the best THD+N level on the headset speakers, the
You need to avoid ground loops, run digital and analog
Footprint
Micro10
PCB
0805
1812
1206
−
−
−
−
−
ON Semiconductor
Manufacturer
ON Semiconductor
Phoenix
CUI Inc
Decelect−Forgos
Vishay
Vishay−Draloric
TDK
Manufacturer
RS
NA
NA
Weidmüller
Weidmüller
Murata
Kemet
Kemet
−
Manufacturer Part Number
CRCW08052022FNEA
C2012X7R1C105K
GRM42−6X7R105K16
MSTBA 2,5/2−G
C1812C394M5UAC
RS 546−3406
D12CRCW Series
T495X227010AS
NCP2809B
SJ−3515N
Manufacturer
SL5.08/2/90B
SL5.08/3/90B
Reference
IES 101−3
NCP2809
NA
NA
−