RD3172MMA7455L Freescale Semiconductor, RD3172MMA7455L Datasheet - Page 31

• Manufacturer Part Number: RD3172MMA7455L
• Description: EVAL BOARD FOR MMA7455L
• Manufacturer: Freescale Semiconductor
• Series: ZSTAR3r

Specifications of RD3172MMA7455L

• Design Resources: ZSTAR3 Schematic
• Sensor Type: Accelerometer, 3 Axis
• Sensing Range: ±2g, 4g, 8g
• Interface: RF
• Sensitivity: 16, 32, 64 LSB/g
• Voltage - Supply: 3V
• Embedded: Yes, MCU, 16-Bit
• Utilized Ic / Part: MMA7455
• Acceleration: 5000 g
• Sensing Axis: Triple Axis
• Output Type: Digital
• Interface Type: I2C, SPI
• Operating Voltage: 3.6 L
• Operating Current: 490 uA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: MMA7455L

6.
7.
8.
9.
10. Do not use a screw down or stacking to fix the PCB into an enclosure because this could bend the PCB putting stress on
11. The PCB should be rated for the multiple lead-free reflow condition with max 260°C temperature.
Please cross reference with the device data sheet for mounting guidelines specific to the exact device used.
Freescale LGA sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide free molding compound
(green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-copper
(Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those processes can be used successfully for solder-
ing the devices.
Sensors
Freescale Semiconductor
Do not place any components or vias at a distance less than 2 mm from the package land area. This may cause additional
package stress if it is too close to the package land area.
Signal traces connected to pads should be as symmetric as possible. Put dummy traces on NC pads in order to have same
length of exposed trace for all pads. Signal traces with 0.1 mm width and min. 0.5 mm length for all PCB land pads near the
package are recommended as shown in
Use a standard pick and place process and equipment. Do not us a hand soldering process.
It is recommended to use a cleanable solder paste with an additional cleaning step after SMT mount.
the package.
10x0.8mm
Figure 22. Stencil Design Guidelines
Figure 21
and
14x0.575mm
Figure
22. Wider trace can be continued after the 0.5 mm zone.
Signal trace near
package
14x0.875mm
Package
footprint
Stencil opening = PCB landing
pad -0.025mm
= 0.575mmx0,875mm
MMA7455L
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