TSSEVB Freescale Semiconductor, TSSEVB Datasheet - Page 27

• Manufacturer Part Number: TSSEVB
• Description: BOARD EVALUATION TOUCH SENSING
• Manufacturer: Freescale Semiconductor

Specifications of TSSEVB

• Sensor Type: Touch, Capacitive
• Interface: USB
• Embedded: Yes, MCU, 8-Bit
• Interface Type: USB, I2C, SCI, SPI
• Operating Voltage: 5 V
• Data Bus Width: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Sensitivity: -
• Utilized Ic / Part: -
• Sensing Range: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: S08LG32

System Overview
2.3.6
BDM has the ability to program either the MC9S08LG32 MCU or the MC9S08JM60 Comm MCU.
2.3.7
The communication port provides access to the communication modules of the MC9S08JM60 Comm
MCU.
2.3.8
When using the Electrode Graphing Tool, the communication between the MC9S08LG32 MCU and the
MC9S08JM60 Comm MCU is required. The communication is achieved through the IIC module from
each MCUs. J10 and J11 connect the IIC modules from both MCUs.
2-20
1. To choose the MC9S08LG32 MCU as a programming target, place jumpers on position 5–3 and
2. To choose the MC9S08JM60 Comm MCU as a programming target, place jumpers on position 3–1
1. To connect the SCL signals of the MC9S08LG32 MCU and the MC9S08JM60 Comm MCU, place
Table 2-4
6–4 on J6.
and 4–2 on J6.
the jumper on J10.
BDM Header
Comm PORT
IIC Communication
shows the MC9S08JM60 Comm MCU peripherals.
Figure 2-10. Jumper Placement for the MC9S08JM60 Comm MCU
Figure 2-9. Jumper Placement for the MC9S08LG32 MCU
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
SPSCK1
MISO1
MOSI1
Table 2-4. MC9S08JM60 Comm MCU Peripherals
SS1
VIN
1
3
5
7
9
J6
J6
BDM Header
BDM Header
10
2
4
6
8
GND
SDA
RX1
SCL
TX1
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