TSSEVB Freescale Semiconductor, TSSEVB Datasheet - Page 8

• Manufacturer Part Number: TSSEVB
• Description: BOARD EVALUATION TOUCH SENSING
• Manufacturer: Freescale Semiconductor

Specifications of TSSEVB

• Sensor Type: Touch, Capacitive
• Interface: USB
• Embedded: Yes, MCU, 8-Bit
• Interface Type: USB, I2C, SCI, SPI
• Operating Voltage: 5 V
• Data Bus Width: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Sensitivity: -
• Utilized Ic / Part: -
• Sensing Range: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: S08LG32

Chapter 2
System Overview
2.1
This chapter describes the basic components, functionality, and power supply options of TSSEVB. It also
includes the schematic and Bill of Materials (BOM) for the TSSEVB. For more information on how to set
the Freescale Touch Sensing Software primitives and the development environment, refer to the Touch
Sensing Software API Reference Manual (document TSSAPIRM).
Features of TSSEVB:
2.1.1
Figure 2-1
Freescale Semiconductor
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TSSEVB includes a demonstration application that allows you to start testing TSS within minutes.
TSSEVB includes a Communication MCU (MC9S08JM60 Comm MCU) that serves as a bridge
between the application and the PC to evaluate the Electrode Graphing Tool (EGT) along with TSS.
TSSEVB includes all the decoding structures supported by TSS along with special electrodes, such
as different size electrodes and multiplexed electrodes supported by TSS.
The EVB also contains a custom on-board display that allows you to explore the software
development combining the integrated LCD driver with TSS. The LCD contains special segments
to be used with TSS.
TSSEVB includes an MC9S08LG32 device from the S08 family of 8-bit microcontrollers. The LG
family offers improved performance and flexible pin functionality for a wide range of industrial
and automotive applications, such as electric metering, home appliances, HVAC systems, and entry
level instrument clusters.
TSSEVB includes an OSBDM module that allows programming of the MC9S08LG32 MCU and
the MC9S08JM60 Comm MCU. There is no need to use an external BDM module to load
applications into the MC9S08LG32 MCU.
TSSEVB can be powered using three different sources:
— Through the USB port
— Through the mini USB port
— By connecting the board to the voltage converter included in the TSSEVB kit.
Introduction
shows the front view of TSSEVB and the main modules present.
TSSEVB Modules
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
2-1