DM300024 Microchip Technology, DM300024 Datasheet - Page 23

• Manufacturer Part Number: DM300024
• Description: KIT DEMO DSPICDEM 1.1
• Manufacturer: Microchip Technology
• Type: MCUr

Specifications of DM300024

• Contents: Board, Cable, CD, Power Supply
• Silicon Manufacturer: Microchip
• Core Architecture: DsPIC
• Core Sub-architecture: DsPIC30F
• Features: Serial Communication Channels Interface, General Purpose Prototyping Area
• Silicon Core Number: DsPIC30F, DsPIC33F
• Silicon Family Name: DsPIC30F6xxx, DsPIC33FJxxGPxxx
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: dsPIC30F/33F and PIC24H
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

2.5
© 2006 Microchip Technology Inc.
BUILDING THE CODE
In this project, building the code consists of assembling the Tut6014A.s file to create
an object file, Tut6014A.o, and then linking the object file to create the
Tut6014A.hex and Tut6014A.cof output files. The .hex file contains the data nec-
essary to program the device and the .cof file contains additional information that lets
you debug at the source code level.
Before building, there are settings required to tell MPLAB IDE where to find the include
files and to reserve space for the extra debug code when the MPLAB ICD 2 is used.
The following line is near the top of the Tut6014A.s file:
.include "p30f6014A.inc"
This line causes a standard include file to be used. Microchip provides these files with
all the Special Function Register (SFR) labels already defined for convenience.
To build the code, select Build Options>Project from the Project> menu. The Build
Options dialog displays, as shown in Figure 2-7.
FIGURE 2-7:
BUILD OPTIONS
Browse to the location of the
assembler Include folder.
Using dsPIC30F Devices
DS70099D-page 19