3DK1657 Renesas Electronics America, 3DK1657 Datasheet - Page 3

• Manufacturer Part Number: 3DK1657
• Description: DEV EVAL KIT FOR H8SX/1657
• Manufacturer: Renesas Electronics America
• Series: H8®r
• Type: MCUr

Specifications of 3DK1657

• Contents: 3-D Board, Jumper Link, Header Connectors and CD-ROM
• For Use With/related Products: H8SX/1657
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

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ABLE OF
6.1. SWITCHES...........................................................................................................................................................5
6.2. LEDS ....................................................................................................................................................................6
6.3. POTENTIOMETER...............................................................................................................................................6
6.4. SERIAL PORT ......................................................................................................................................................6
6.5. JUMPERS.............................................................................................................................................................7
8.1. BOOT MODE........................................................................................................................................................8
8.2. USER MODE ........................................................................................................................................................8
9.1. PORT PROGRAMMING.......................................................................................................................................9
9.2. FDM HEADER ......................................................................................................................................................9
9.3. E7 HEADER..........................................................................................................................................................9
9.4. OFF-BOARD PROGRAMMING............................................................................................................................9
10.1. MICON HEADERS..............................................................................................................................................10
10.2. GENERIC HEADERS .........................................................................................................................................12
11.1. OVERVIEW ........................................................................................................................................................12
11.2. MODE SUPPORT...............................................................................................................................................12
11.3. BREAKPOINT SUPPORT ..................................................................................................................................13
11.4. CODE LOCATED IN RAM..................................................................................................................................13
11.5. HMON CODE SIZE.............................................................................................................................................13
11.6. MEMORY MAP...................................................................................................................................................13
11.7. BAUD RATE SETTING.......................................................................................................................................14
11.8. INTERRUPT MASK SECTIONS.........................................................................................................................15
11.9. ADDITIONAL INFORMATION ............................................................................................................................15
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EQUIREMENTS
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EHAVIOUR
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