MPC8536E-ANDROID Freescale Semiconductor, MPC8536E-ANDROID Datasheet - Page 124

• Manufacturer Part Number: MPC8536E-ANDROID
• Description: HARDWARE/SOFTWARE ANDROID OS
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC ™r
• Type: MPUr

Specifications of MPC8536E-ANDROID

• Contents: Board
• For Use With/related Products: MPC8536
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Parameters for the MPC8536E FC-PBGA
5
This section details package parameters, pin assignments, and dimensions.
5.1
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783 flip chip plastic ball
grid array (FC-PBGA) without a lid.
124
600/400/400
800/400/400
1000/400/400
1250/500/500
1333/533/667
1500/500/667
Note:
1. The last letter A indicates a Rev 1.2 silicon. It would be Rev 1.0 or Rev 1.1 silicon without a letter A
Core/Platform/
DDR (MHz)
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Solder Balls
Ball diameter (typical)
Package Information
Package Parameters for the
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
MPC8536BVTAKG(A) MPC8536EBVTAKG(A) MPC8536CVTAKG(A) MPC8536ECVTAKG(A)
MPC8536BVTANG(A) MPC8536EBVTANG(A) MPC8536CVTANG(A) MPC8536ECVTANG(A)
MPC8536BVTAQG(A) MPC8536EBVTAQG(A) MPC8536CVTAQG(A) MPC8536ECVTAQG(A)
MPC8536BVTATH(A) MPC8536EBVTATH(A) MPC8536CVTATH(A) MPC8536ECVTATH(A)
MPC8536BVTAUL(A) MPC8536EBVTAUL(A) MPC8536CVTAUL(A) MPC8536ECVTAUL(A)
MPC8536BVTAVL(A) MPC8536EBVTAVL(A) MPC8536CVTAVL(A) MPC8536ECVTAVL(A)
Without Security
Standard Temp
Table 84. MPC8536 Part Numbers Industrial Tier
Standard Temp
With Security
29 mm × 29 mm
783
1 mm
2.23 mm
2.8 mm
96.5Sn/3.5Ag
0.6 mm
MPC8536E
Without Security
Extended Temp
FC-PBGA
Extended Temp
With Security
Freescale Semiconductor
Notes
1