NLSF595EVB ON Semiconductor, NLSF595EVB Datasheet - Page 13
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NLSF595EVB
Manufacturer Part Number
NLSF595EVB
Description
BOARD EVAL TRICOLOR LED DRIVER
Manufacturer
ON Semiconductor
Specifications of NLSF595EVB
Design Resources
NLSF595 Demo Board BOM NLSF595EVB Gerber Files
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With/related Products
NLSF595
Other names
NLSF595EVB
NLSF595EVBOS
NLSF595EVBOS
0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.15 C
L
K
PIN 1
0.15 C
NOTE 3
A B
16X
b
4
1
Ç Ç
Ç Ç
16
BOTTOM VIEW
TOP VIEW
5
D2
D
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
e
13
0.575
0.022
0.128
3.25
8
12
9
EXPOSED PAD
e
A
B
E
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
E2
http://onsemi.com
CASE 485G−01
0.012
0.30
MN SUFFIX
NLSF595
ISSUE B
QFN−16
0.128
3.25
16 X
13
0.10 C
0.08 C
0.50
0.02
SCALE 10:1
EXPOSED PAD
0.059
1.50
0.012
0.30
SIDE VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
inches
mm
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
DIM
A1
A3
D2
E2
max
A
b
D
E
K
L
e
CONDITION CAN NOT VIOLATE 0.2 MM
MILLIMETERS
MIN
0.80
0.00
0.18
1.65
1.65
0.20
0.30
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
(A3)
MAX
1.00
0.05
0.30
1.85
1.85
0.50
−−−
A1
A
C
SEATING
PLANE