HDJD-JD06 Avago Technologies US Inc., HDJD-JD06 Datasheet - Page 10

• Manufacturer Part Number: HDJD-JD06
• Description: KIT DEV RGB COLOR SENSOR 16-QFN
• Manufacturer: Avago Technologies US Inc.

Specifications of HDJD-JD06

• Sensor Type: Light, Color Sensor
• Sensing Range: RGB
• Interface: Analog
• Voltage - Supply: 4.5 V ~ 5.5 V
• Embedded: No
• Utilized Ic / Part: ADJD-E622-QR999
• For Use With/related Products: ADJD-E622-QR999
• Lead Free Status / RoHS Status: Not applicable / Not applicable

Recommendations for Handling and Storage of ADJD E622 QR999
This product is qualified as Moisture Sensitive Level 3 per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application
Note AN5305 Handling Of Moisture Sensitive Surface Mount Devices for details.
A. Storage before use
- Unopened moisture barrier bag (MBB) can be stored at 30°C and 90%RH or less for maximum 1 year
- It is not recommended to open the MBB prior to assembly (e.g. for IQC)
- It should also be sealed with a moisture absorbent material (Silica Gel) and an indicator card (cobalt chloride)
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read immediately upon opening of MBB
- The components must be kept at <30°C/60%RH at all time and all high temperature related process including
C. Control for unfinished reel
- For any unused components, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH
D. Control of assembled boards
- If the PCB soldered with the components is to be subjected to other high temperature processes, the PCB
E. Baking is required if:
- “10%” or “15%” HIC indicator turns pink
- The components are exposed to condition of >30°C/60%RH at any time.
- The components floor life exceeded 168hrs
- Recommended baking condition (in component form): 125°C for 24hrs
16 Lead QFN Recommended PCB Land Pad Design
IPC-SM-782 is used as the standard for the PCB land-
pad design. Recommended PCB finishing is gold plated.
Figure 7.
10
5.5 mm
to indicate the moisture within the bag
soldering, curing or rework need to be completed within 168hrs
need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no components have
exceeded their floor life of 168hrs
0.4 mm
3.19 mm
3.19 mm
5.5 mm
3.9
0.8 mm
0.8 mm
16 Lead QFN Recommended Stencil Design
A stencil thickness of 2.18mm (6mils) for this QFN
package is recommended.
Figure 8.
0.4 mm
0.8 mm
2.18mm