AD9779-EBZ Analog Devices Inc, AD9779-EBZ Datasheet - Page 56

• Manufacturer Part Number: AD9779-EBZ
• Description: BOARD EVALUATION FOR AD9779
• Manufacturer: Analog Devices Inc

Specifications of AD9779-EBZ

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9776/AD9778/AD9779
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9776BSVZ
AD9776BSVZRL
AD9778BSVZ
AD9778BSVZRL
AD9779BSVZ
AD9779BSVZRL
AD9776-EB
AD9778-EB
AD9779-EBZ
1
©2005–2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
SEATING
PLANE
0.75
0.60
0.45
0.20
0.09
MAX
1.20
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
3.5°
7°
0°
Figure 116. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
D05361-0-3/07(A)
25
1
100
26
0.50 BSC
16.00 BSC SQ
PIN 1
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
(PINS DOWN)
TOP VIEW
Dimensions shown in millimeters
14.00 BSC SQ
0.27
0.22
0.17
Rev. A | Page 56 of 56
(SV-100-1)
0.15
0.05
50
76
75
51
Package Description
100-lead TQFP_EP
100-lead TQFP_EP
100-lead TQFP_EP
100-lead TQFP_EP
100-lead TQFP_EP
100-lead TQFP_EP
Evaluation Board
Evaluation Board
Evaluation Board
1.05
1.00
0.95
COPLANARITY
0.08
75
51
50
76
BOTTOM VIEW
CONDUCTIVE
HEAT SINK
(PINS UP)
NOM
6.50
Package Option
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
100
26
1
25