KIT33291DWEVB Freescale Semiconductor, KIT33291DWEVB Datasheet - Page 5

• Manufacturer Part Number: KIT33291DWEVB
• Description: KIT EVAL FOR MC33291 SMART SW
• Manufacturer: Freescale Semiconductor

Specifications of KIT33291DWEVB

• Main Purpose: Power Management, Low Side Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33291
• Primary Attributes: 8 Channel Internal Switch
• Secondary Attributes: Overvoltage, Short-Circuit & Thermal Protection
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 3. Maximum Ratings (continued)
permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
Notes
Thermal Resistance
12.
13.
14.
15.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
Junction-to-Ambient (Natural Convection, Single-Layer Board)
Junction-to-Ambient (Natural Convection, Four-Layer Board)
Junction to Board
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8.
(15)
Rating
(12)
(12)
,
(14)
,
(13)
Symbol
R
R
R
JMA
JA
JL
ELECTRICAL CHARACTERISTICS
Value
68
44
20
MAXIMUM RATINGS
Unit
C/W
33291
5