MT9V022I77ATMH ES Aptina LLC, MT9V022I77ATMH ES Datasheet - Page 14

• Manufacturer Part Number: MT9V022I77ATMH ES
• Description: KIT HEAD BOARD FOR MT9V022
• Manufacturer: Aptina LLC

Specifications of MT9V022I77ATMH ES

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1204

Figure 15:
PDF:09005aef8201ffc3/Source: 09005aef81ff2525
MT9V022_Product_Brief - Rev. A 1/06 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. THE
PRE-REFLOW
DIAMETER IS 0.50.
SEATING
PLANE
52X Ø0.55
7.00
0.10 A
1.00 TYP
3.50
B
A
52-Ball IBGA Package Outline Drawing
4.50 ±0.05
BALL A8
Note:
9.000 ±0.075
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2%Ag
1.00 TYP
NON SOLDER MASK DEFINED BALL PADS: Ø0.40
7.00
C L
SUBSTRATE MATERIAL: PLASTIC LAMINATE
(FOR REFERENCE ONLY)
All dimensions in millimeters.
3.50
0.125 (FOR REFERENCE ONLY)
OR 96.5% Sn, 3% Ag, 0.5% Cu
ENCAPSULANT: EPOXY
0.40
BALL A1
C L
4.50 ±0.05
BALL A1 ID
0.375 ±0.075
0.525 ±0.050
9.000 ±0.075
0.90 (FOR REFERENCE ONLY)
MT9V022: 1/3-Inch Wide-VGA Digital Image Sensor
1.50 MAX
14
4.500 ±0.075
OPTICAL
MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES: 1º
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO PACKAGE EDGE
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS: 50 MICRONS.
CENTER
BALL A1
CORNER
LID MATERIAL: BOROSILICATE GLASS 0.40 THICKNESS
IMAGE SENSOR DIE
Micron Technology, Inc., reserves the right to change products or specifications without notice.
OPTICAL
1.999
AREA
1.849
OPTICAL CENTER
4.500 ±0.075
Electrical Specifications
5.50
FUSES
©2006 Micron Technology, Inc. All rights reserved.
FIRST
CLEAR
PIXEL
4.90
B
: 50 MICRONS.