1812SC103KAT1A AVX Corporation, 1812SC103KAT1A Datasheet - Page 16
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1812SC103KAT1A
Manufacturer Part Number
1812SC103KAT1A
Description
CAP CER 10000PF 1500V X7R 1812
Manufacturer
AVX Corporation
Specifications of 1812SC103KAT1A
Capacitance
10000pF
Package / Case
1812 (4532 Metric)
Voltage - Rated
1500V (1.5kV)
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
High Voltage
Applications
General Purpose
Size / Dimension
0.177" L x 0.126" W (4.50mm x 3.20mm)
Thickness
2.54mm Max
Tolerance (+ Or -)
10%
Voltage
1500VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
4.5mm
Product Depth (mm)
3.2mm
Product Height (mm)
2.54mm
Product Diameter (mm)
Not Requiredmm
Capacitor Application
High Voltage
Dielectric Characteristic
X7R
Capacitance Tolerance
± 10%
Voltage Rating
1500VDC
Capacitor Case Style
1812
No. Of Pins
2
Rohs Compliant
Yes
Case Size
1812
Material, Element
Ceramic
Special Features
High Voltage
Termination
SMT
Voltage, Rating
1500 VDC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
RoHS Compliant part
Other names
1812SC103KAT1A
478-4735-2
478-4735-2
Surface Mounting Guide
MLC Chip Capacitors
APPLICATION NOTES
Storage
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
Solderability
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Leaching
Terminations will resist leaching for at least the immersion
times and conditions shown below.
Recommended Soldering Profiles
Lead-Free Reflow Profile
Termination Type
Nickel Barrier
300
250
200
150
100
50
0
0
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
Reflow
300
250
200
150
100
50
0
(Minimize soldering time)
50
1min
Tin/Lead/Silver Temp. °C
Preheat
60/40/0
Solder
100
1min
150
10 sec. max
260 ± 5
Solder
220°C
250°C
to
200
Natural
Cooling
Immersion Time
Time (s)
Seconds
250
30 ± 1
300
Lead-Free Wave Soldering
The recommended peak temperature for lead-free wave
soldering is 250°C-260°C for 3-5 seconds. The other para-
meters of the profile remains the same as above.
The following should be noted by customers changing from
lead based systems to the new lead free pastes.
a) The visual standards used for evaluation of solder joints
b) Resin color may darken slightly due to the increase in
c) Lead-free solder pastes do not allow the same self align-
General
Surface mounting chip multilayer ceramic capacitors
are designed for soldering to printed circuit boards or other
substrates. The construction of the components is such that
they will withstand the time/temperature profiles used in both
wave and reflow soldering methods.
Handling
Chip multilayer ceramic capacitors should be handled with
care to avoid damage or contamination from perspiration
and skin oils. The use of tweezers or vacuum pick ups
is strongly recommended for individual components. Bulk
handling should ensure that abrasion and mechanical shock
are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
Preheat
It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
will need to be modified as lead free joints are not as
bright as with tin-lead pastes and the fillet may not be as
large.
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
temperature required for the new pastes.
Wave
300
250
200
150
100
50
0
(Preheat chips before soldering)
T/maximum 150°C
1 to 2 min
Preheat
T
3 sec. max
230°C
250°C
to
Natural
Cooling
71