1812SC103KAT1A AVX Corporation, 1812SC103KAT1A Datasheet - Page 18
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1812SC103KAT1A
Manufacturer Part Number
1812SC103KAT1A
Description
CAP CER 10000PF 1500V X7R 1812
Manufacturer
AVX Corporation
Specifications of 1812SC103KAT1A
Capacitance
10000pF
Package / Case
1812 (4532 Metric)
Voltage - Rated
1500V (1.5kV)
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
High Voltage
Applications
General Purpose
Size / Dimension
0.177" L x 0.126" W (4.50mm x 3.20mm)
Thickness
2.54mm Max
Tolerance (+ Or -)
10%
Voltage
1500VDC
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Construction
SMT Chip
Case Style
Ceramic Chip
Failure Rate
Not Required
Wire Form
Not Required
Product Length (mm)
4.5mm
Product Depth (mm)
3.2mm
Product Height (mm)
2.54mm
Product Diameter (mm)
Not Requiredmm
Capacitor Application
High Voltage
Dielectric Characteristic
X7R
Capacitance Tolerance
± 10%
Voltage Rating
1500VDC
Capacitor Case Style
1812
No. Of Pins
2
Rohs Compliant
Yes
Case Size
1812
Material, Element
Ceramic
Special Features
High Voltage
Termination
SMT
Voltage, Rating
1500 VDC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Lead Free Status / Rohs Status
RoHS Compliant part
Other names
1812SC103KAT1A
478-4735-2
478-4735-2
Surface Mounting Guide
MLC Chip Capacitors
PCB BOARD DESIGN
To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of
board. However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the
MLC is located.
COMMON CAUSES OF
MECHANICAL CRACKING
The most common source for mechanical stress is board
depanelization equipment, such as manual breakapart, v-
cutters and shear presses. Improperly aligned or dull cutters
may cause torqueing of the PCB resulting in flex stresses
being transmitted to components near the board edge.
Another common source of flexural stress is contact during
parametric testing when test points are probed. If the PCB
is allowed to flex during the test cycle, nearby ceramic
capacitors may be broken.
A third common source is board to board connections at
vertical connectors where cables or other PCBs are con-
nected to the PCB. If the board is not supported during the
plug/unplug cycle, it may flex and cause damage to nearby
components.
Special care should also be taken when handling large (>6"
on a side) PCBs since they more easily flex or warp than
smaller boards.
Preferred Method - No Direct Part Contact
No Stress Relief for MLCs
Solder Tip
REWORKING OF MLCs
Thermal shock is common in MLCs that are manually
attached or reworked with a soldering iron. AVX strongly
recommends that any reworking of MLCs be done with hot
air reflow rather than soldering irons. It is practically impossi-
ble to cause any thermal shock in ceramic capacitors when
using hot air reflow.
However direct contact by the soldering iron tip often caus-
es thermal cracks that may fail at a later date. If rework by
soldering iron is absolutely necessary, it is recommended
that the wattage of the iron be less than 30 watts and the
tip temperature be <300ºC. Rework should be performed
by applying the solder iron tip to the pad and not directly
contacting any part of the ceramic capacitor.
Routed Cut Line Relieves Stress on MLC
Poor Method - Direct Contact with Part
Solder Tip
73