ST203C107MAJ05 AVX Corporation, ST203C107MAJ05 Datasheet - Page 56

• Manufacturer Part Number: ST203C107MAJ05
• Description: CAP CER 100UF 25V STACKED SMD
• Manufacturer: AVX Corporation
• Series: TurboCap™r

Specifications of ST203C107MAJ05

• Capacitance: 100µF
• Tolerance: ±20%
• Temperature Coefficient: X7R
• Voltage - Rated: 25V
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Stacked
• Applications: Filtering Switch Mode Power Supplies
• Package / Case: 10-Stacked SMD, J-Lead
• Size / Dimension: 0.525" L x 0.300" W (13.34mm x 7.62mm)
• Thickness: 5.59mm Max
• Lead Style: J-Lead
• Voltage Rating: 25 Volts
• Operating Temperature Range: - 55 C to + 125 C
• Product: General Type MLCCs
• Dielectric Characteristic: X7R
• Capacitance Tolerance: ± 20%
• Capacitor Case Style: DIP
• No. Of Pins: 10
• Capacitor Mounting: SMD
• Rohs Compliant: No
• Termination Style: Radial
• Lead Spacing: 6.35 mm
• Dimensions: 7.62 mm W x 13.34 mm L x 5.59 mm H
• Dissipation Factor Df: 2.5
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Ratings: -
• Lead Spacing: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 478-6116

SMPS Capacitors
Assembly Guidelines
General Processing Guidelines
Figure 2 shows the location of maximum stress in the solder
joint due to positive and negative DCTE and linear displace-
ment.
Stress Relief
Leadframes on larger capacitor sizes (greater than 2225) must
be used to minimize mechanical stress on the solder joints dur-
ing temperature cycling which is normal operation for power
supplies (Figure 3). Failing solder joints increase both ESR and
ESL causing an increase in ripple, noise and heat, accelerating
failure.
Layout
Effective solder dams must be used to keep all molten solder
on the solder lands during reflow or solder will migrate away
from the land, causing opens or weak solder joints. High fre-
quency output filters cannot use low power layout techniques
such as necked down conductors because of the stringent
inductance requirements.
Stress for
Stress for
MAXIMUM STRESS
T
T
Figure 1. Linear Displacement Between
CAPACITOR
CAPACITOR
oper
oper
T
>
>
T
oper
T
T
oper
CAPACITOR
CAPACITOR
amb
SUBSTRATE
amb
CAPACITOR
SUBSTRATE
CAPACITOR
SUBSTRATE
Component and Substrate
CTE
CTE
>
>
T
T
sub
sub
amb
amb
SUBSTRATE
SUBSTRATE
>
<
CTE
CTE
CTE
Figure 2
CTE
cap
cap
sub
sub
>
<
CTE
CTE
cap
cap
DIMENSIONS
AT AMBIENT
TEMPERATURE
SUBSTRATE LINEAR
DISPLACEMENT
PUTS SOLDER JOINT
AND CAPACITOR IN
TENSION
SUBSTRATE LINEAR
DISPLACEMENT
PUTS SOLDER JOINT
AND CAPACITOR IN
COMPRESSION
MAXIMUM STRESS
SOLDER
FILLET
SOLDER
FILLET
Inductance
Adding leadframes has a small impact on component induc-
tance but this is the price that must be paid for reliable operation
over temperature. Figure 4 shows typical leadframe inductance
that is added for two lead standoff distances (0.020" and 0.050")
versus the number of leads along one side of SupraCap
are specifically designed output filter capacitors for 1 MHz and
above switchers. The actual inductance will be somewhat less
because the leadframes flare out from the lead where the lead-
frame is attached to the capacitor body.
Very high frequency switch mode power supplies place
tremendous restrictions on output filter capacitors. In addition
to handling high ripple current (low ESR), ESL must approach
zero nano henrys, part must be truly surface mountable
and be available in new configurations to be integrated into
transmission lines to further reduce inductance with load
currents greater than 40A at 1 MHz and as frequencies move
above 1-2 MHz.
The total inductance is the sum of each side of the part where
the inductance of one side is the parallel combination of each
lead in the leadframe. That inductance is given by:
so L 1 (nH) = 2xL (nH) where L 1 is the total inductance of the
leadframe.
Figure 4. Number of Leads on One Side of Capacitor vs. Total
0.4
0.3
0.1
0.2
L (nH) = 5x [In (2x ) / (B+C) + 1/2]
Leadframe Inductance vs. Substrate Standoff Height
0
Where
SOLDER LAND
Figure 3. “J” and “L” Leadframes Mounted on
CAPACITOR
BODY
0.020"
Standoff
B+C = lead cross section in inches
In = natural log
= lead length in inches
Capacitors to Relieve Stress
Number of leads on one side of Capacitor
5
0.050"
Standoff
SUBSTRATE
"J" LEADS
"L" LEADS
SOLDER
FILLETS
10
CAPACITOR
15
BODY
20
®
which
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