PESD5V0U4BW,115 NXP Semiconductors, PESD5V0U4BW,115 Datasheet
PESD5V0U4BW,115
Specifications of PESD5V0U4BW,115
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PESD5V0U4BW,115 Summary of contents
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PESD5V0U4BF; PESD5V0U4BW Ultra low capacitance bidirectional quadruple ESD protection arrays Rev. 01 — 15 August 2008 1. Product profile 1.1 General description Ultra low capacitance bidirectional quadruple ElectroStatic Discharge (ESD) protection arrays in ultra small Surface-Mounted Device (SMD) plastic packages ...
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... NXP Semiconductors 1.4 Quick reference data Table unless otherwise specified. amb Symbol Per diode V RWM Pinning information Table 3. Pin PESD5V0U4BF PESD5V0U4BW Ordering information Table 4. Type number PESD5V0U4BF PESD5V0U4BW PESD5V0U4BF_PESD5V0U4BW_1 Product data sheet PESD5V0U4BF; PESD5V0U4BW Ultra low capacitance bidirectional quadruple ESD protection arrays ...
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... NXP Semiconductors 4. Marking Table 5. Type number PESD5V0U4BF PESD5V0U4BW 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device amb T stg Table unless otherwise specified. amb Symbol Per diode V ESD [1] Device stressed with ten non-repetitive ESD pulses. ...
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... NXP Semiconductors Table 8. Standard Per diode IEC 61000-4-2; level 4 (ESD) MIL-STD-883; class 3 (human body model) Fig 1. PESD5V0U4BF_PESD5V0U4BW_1 Product data sheet PESD5V0U4BF; PESD5V0U4BW Ultra low capacitance bidirectional quadruple ESD protection arrays ESD standards compliance I PP 100 % 0 ESD pulse waveform according to IEC 61000-4-2 Rev. 01 — ...
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... NXP Semiconductors 6. Characteristics Table unless otherwise specified. amb Symbol Parameter Per diode V RWM dif 3 (pF) 2.6 2.2 1 MHz amb Fig 2. Diode capacitance as a function of reverse voltage; typical values PESD5V0U4BF_PESD5V0U4BW_1 Product data sheet PESD5V0U4BF; PESD5V0U4BW Ultra low capacitance bidirectional quadruple ESD protection arrays ...
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... NXP Semiconductors ESD TESTER IEC 61000-4-2 network C = 150 pF 330 Z Z GND unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) GND unclamped 8 kV ESD pulse waveform (IEC 61000-4-2 network) Fig 4. ESD clamping test setup and waveforms PESD5V0U4BF_PESD5V0U4BW_1 Product data sheet PESD5V0U4BF; PESD5V0U4BW ...
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... NXP Semiconductors 7. Application information The PESD5V0U4BF and the PESD5V0U4BW are designed for the protection four bidirectional data or signal lines from the damage caused by ESD and surge pulses. The devices may be used on lines where the signal polarities are both, positive and negative with respect to ground ...
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... NXP Semiconductors 9. Package outline 1.05 0.95 0.6 0. 0.17 0.5 1 1.4 0 0.40 0.35 0.32 0.27 Dimensions in mm Fig 6. Package outline PESD5V0U4BF (SOT886) 10. Packing information Table 10. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PESD5V0U4BF PESD5V0U4BW SOT665 ...
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... NXP Semiconductors 11. Soldering Fig Fig 9. PESD5V0U4BF_PESD5V0U4BW_1 Product data sheet PESD5V0U4BF; PESD5V0U4BW Ultra low capacitance bidirectional quadruple ESD protection arrays 1.250 0.675 0.370 (6 ) 0.270 (6 ) 0.325 0.425 ( Reflow soldering is the only recommended soldering method. Reflow soldering footprint PESD5V0U4BF (SOT886) 2.45 2.1 1.6 0 ...
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... NXP Semiconductors 12. Revision history Table 11. Revision history Document ID PESD5V0U4BF_PESD5V0U4BW_1 PESD5V0U4BF_PESD5V0U4BW_1 Product data sheet PESD5V0U4BF; PESD5V0U4BW Ultra low capacitance bidirectional quadruple ESD protection arrays Release date Data sheet status 20080815 Product data sheet Rev. 01 — 15 August 2008 Change notice Supersedes - - © NXP B.V. 2008. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering ...