LPC2361FBD100,551 NXP Semiconductors, LPC2361FBD100,551 Datasheet - Page 29

IC ARM7 MCU FLASH 64K 100LQFP

LPC2361FBD100,551

Manufacturer Part Number
LPC2361FBD100,551
Description
IC ARM7 MCU FLASH 64K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2361FBD100,551

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
34K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
34 KB
Interface Type
CAN/I2S/SPI/SSP/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
100LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4525
935286991551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2361FBD100,551
Quantity:
9 999
Part Number:
LPC2361FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC2361_62_4
Product data sheet
7.23.4.3 Power-down mode
7.23.4.4 Deep power-down mode
7.23.4.5 Power domains
32 kHz RTC oscillator is not stopped because the RTC interrupts may be used as the
wake-up source. The PLL is automatically turned off and disconnected. The CCLK and
USB clock dividers automatically get reset to zero.
The Sleep mode can be terminated and normal operation resumed by either a Reset or
certain specific interrupts that are able to function without clocks. Since all dynamic
operation of the chip is suspended, Sleep mode reduces chip power consumption to a
very low value. The flash memory is left on in Sleep mode, allowing a very quick wake-up.
On the wake-up of Sleep mode, if the IRC was used before entering Sleep mode, the
code execution and peripherals activities will resume after 4 cycles expire. If the main
external oscillator was used, the code execution will resume when 4096 cycles expire.
The customers need to reconfigure the PLL and clock dividers accordingly.
Power-down mode does everything that Sleep mode does, but also turns off the IRC
oscillator and the flash memory. This saves more power, but requires waiting for
resumption of flash operation before execution of code or data access in the flash memory
can be accomplished.
On the wake-up of Power-down mode, if the IRC was used before entering Power-down
mode, it will take IRC 60 μs to start-up. After this 4 IRC cycles will expire before the code
execution can then be resumed if the code was running from SRAM. In the meantime, the
flash wake-up timer then counts 4 MHz IRC clock cycles to make the 100 μs flash start-up
time. When it times out, access to the flash will be allowed. The customers need to
reconfigure the PLL and clock dividers accordingly.
Deep power-down mode is similar to the Power-down mode, but now the on-chip
regulator that supplies power to the internal logic is also shut off. This produces the lowest
possible power consumption without removing power from the entire chip. Since the Deep
power-down mode shuts down the on-chip logic power supply, there is no register or
memory retention, and resumption of operation involves the same activities as a full chip
reset.
If power is supplied to the LPC2361/2362 during Deep power-down mode, wake-up can
be caused by the RTC Alarm interrupt or by external Reset.
While in Deep power-down mode, external device power may be removed. In this case,
the LPC2361/2362 will start up when external power is restored.
Essential data may be retained through Deep power-down mode (or through complete
powering off of the chip) by storing data in the Battery RAM, as long as the external power
to the VBAT pin is maintained.
The LPC2361/2362 provides two independent power domains that allow the bulk of the
device to have power removed while maintaining operation of the RTC and the battery
RAM.
Rev. 04 — 4 March 2010
Single-chip 16-bit/32-bit MCU
LPC2361/62
© NXP B.V. 2010. All rights reserved.
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