MC56F8037VLH Freescale Semiconductor, MC56F8037VLH Datasheet - Page 143

• Manufacturer Part Number: MC56F8037VLH
• Description: IC DSP 16BIT DUAL 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8037VLH

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• Ram Size: 4K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F80xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 32 MIPs
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 53
• Data Ram Size: 8 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MC56F8037EVM
• Interface Type: SCI, SPI, I2C
• Minimum Operating Temperature: - 40 C
• Package: 64LQFP
• Family Name: 56F8xxx
• Maximum Speed: 32 MHz
• On-chip Adc: 2(8-chx10-bit)
• On-chip Dac: 2-chx12-bit
• Number Of Timers: 5
• For Use With: MC56F8037EVM - BOARD EVAL FOR MC56F8037
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

7. See
Note:
Freescale Semiconductor
1. Total chip source or sink current cannot exceed 75mA
Supply voltage
ADC Reference Voltage High
Voltage difference V
Voltage difference V
Device Clock Frequency
Using relaxation oscillator
Using external clock source
Input Voltage High (digital inputs)
Input Voltage Low (digital inputs)
Oscillator Input Voltage High
XTAL driven by an external clock source
Oscillator Input Voltage Low
DAC Output Load Resistance
DAC Output Load Capacitance
Output Source Current High at V
When programmed for low drive strength
When programmed for high drive strength
Output Source Current Low (at V
When programmed for low drive strength
When programmed for high drive strength
Ambient Operating Temperature
(Extended Industrial)
Flash Endurance
(Program Erase Cycles)
Flash Data Retention
Flash Data Retention with <100
Program/Erase Cycles
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Section 12.1
Pin groups are detailed following
Characteristic
for more details on thermal design considerations.
DD
SS
to V
to V
Table 10-4 Recommended Operating Conditions
SSA
DDA
OH
OL
max.)
min.)
Table 10-1
(V
REFL x
1
1
56F8037/56F8027 Data Sheet, Rev. 7
FSYSCLK
Symbol
V
V
V
t
V
V
V
FLRET
V
REFHx
RLD
CLD
= 0V, V
IHOSC
ILOSC
V
I
V
I
T
N
T
DDA
OH
DD,
OL
IH
IL
A
R
DD
SS
F
SSA
Pin Groups 1, 2
Pin Groups 1, 2
Pin Groups 1, 2
Pin Groups 1, 2
T
T
T
J
J
Pin Group 4
Pin Group 4
Pin Group 1
Pin Group 1
A
<= 85°C avg
<= 85°C avg
= 0V, V
= -40°C to
Notes
125°C
SS
= 0V)
10,000
Min
-0.1
-0.1
-0.3
-0.3
3.0
2.0
2.0
-40
3K
15
20
—
—
—
—
—
3
1
0
Typ
3.3
—
0
0
V
General Characteristics
DDA
V
Max
400
105
3.6
0.1
0.1
5.5
0.8
0.8
32
32
DDA
—
—
—
—
-4
-8
4
8
+ 0.3
cycles
ohms
years
years
Unit
MHz
mA
mA
pF
°C
V
V
V
V
V
V
V
V
143