HD64F3687FPIV Renesas Electronics America, HD64F3687FPIV Datasheet - Page 105

• Manufacturer Part Number: HD64F3687FPIV
• Description: MCU 3/5V 56K I-TEMP PB-FREE 64-L
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300H Tinyr

Specifications of HD64F3687FPIV

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI
• Peripherals: PWM, WDT
• Number Of I /o: 45
• Program Memory Size: 56KB (56K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• For Use With: R0K436079S000BE - KIT DEV FOR H8/36079 W/COMPILER
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 5.1
5.1.2
Figure 5.5 shows a typical method of connecting a ceramic resonator.
5.1.3
Connect an external clock signal to pin OSC
connection. The duty cycle of the external clock signal must be 45 to 55%.
Frequency (MHz)
R
C
S
0
(max)
(max)
Connecting Ceramic Resonator
External Clock Input Method
Crystal Resonator Parameters
Figure 5.5 Typical Connection to Ceramic Resonator
2
500
7 pF
Figure 5.6 Example of External Clock Input
OSC
OSC
OSC
OSC
1
2
1
4
120
7 pF
2
1
Open
, and leave pin OSC
8
80
7 pF
C
C
1
2
External clock input
10
60
7 pF
C
C
Rev.5.00 Nov. 02, 2005 Page 71 of 500
1
2
= 5 to 30 pF
= 5 to 30 pF
2
open. Figure 5.6 shows a typical
Section 5 Clock Pulse Generators
16
50
7 pF
REJ09B0027-0500
20
40
7 pF