HD64F3687FPIV Renesas Electronics America, HD64F3687FPIV Datasheet - Page 329

MCU 3/5V 56K I-TEMP PB-FREE 64-L

HD64F3687FPIV

Manufacturer Part Number
HD64F3687FPIV
Description
MCU 3/5V 56K I-TEMP PB-FREE 64-L
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3687FPIV

Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
PWM, WDT
Number Of I /o
45
Program Memory Size
56KB (56K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
R0K436079S000BE - KIT DEV FOR H8/36079 W/COMPILER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3687FPIV
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Section 16 Serial Communication Interface 3 (SCI3)
16.6.2
Multiprocessor Serial Data Reception
Figure 16.17 shows a sample flowchart for multiprocessor serial data reception. If the MPIE bit in
SCR3 is set to 1, data is skipped until data with a 1 multiprocessor bit is sent. On receiving data
with a 1 multiprocessor bit, the receive data is transferred to RDR. An RXI interrupt request is
generated at this time. All other SCI3 operations are the same as those in asynchronous mode.
Figure 16.18 shows an example of SCI3 operation for multiprocessor format reception.
Rev.5.00 Nov. 02, 2005 Page 295 of 500
REJ09B0027-0500

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