HD64F3687FPIV Renesas Electronics America, HD64F3687FPIV Datasheet - Page 320

MCU 3/5V 56K I-TEMP PB-FREE 64-L

HD64F3687FPIV

Manufacturer Part Number
HD64F3687FPIV
Description
MCU 3/5V 56K I-TEMP PB-FREE 64-L
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3687FPIV

Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
PWM, WDT
Number Of I /o
45
Program Memory Size
56KB (56K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
R0K436079S000BE - KIT DEV FOR H8/36079 W/COMPILER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3687FPIV
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Section 16 Serial Communication Interface 3 (SCI3)
Rev.5.00 Nov. 02, 2005 Page 286 of 500
REJ09B0027-0500
TDRE
TEND
LSI
operation
User
processing
Serial
clock
Serial
data
Figure 16.10 Example of SCI3 Transmission in Clocked Synchronous Mode
TXI interrupt
request
generated
Bit 0
Bit 1
TDRE flag
cleared
to 0
Data written
to TDR
1 frame
TXI interrupt request generated
Bit 7
Bit 0
Bit 1
1 frame
Bit 6
TEI interrupt request
generated
Bit 7

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