PIC18F26K22-I/SO Microchip Technology, PIC18F26K22-I/SO Datasheet - Page 11

• Manufacturer Part Number: PIC18F26K22-I/SO
• Description: IC PIC MCU 64KB FLASH 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F26K22-I/SO

• Core Size: 8-Bit
• Program Memory Size: 64KB (32K x 16)
• Core Processor: PIC
• Speed: 64MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 24
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 19x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (0.300", 7.50mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 25
• Eeprom Memory Size: 1KB
• Ram Memory Size: 3896Byte
• Cpu Speed: 64MHz
• No. Of Timers: 7
• Processor Series: PIC18F
• Core: PIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports .................................................................................................................................................................................. 133
11.0 Timer0 Module ........................................................................................................................................................................ 159
12.0 Timer1/3/5 Module with Gate Control...................................................................................................................................... 163
13.0 Timer2/4/6 Module .................................................................................................................................................................. 175
14.0 Capture/Compare/PWM Modules ........................................................................................................................................... 179
15.0 Master Synchronous Serial Port (MSSP1 and MSSP2) Module ............................................................................................. 209
16.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) .............................................................. 265
17.0 Analog-to-Digital Converter (ADC) Module ............................................................................................................................. 293
18.0 Comparator Module................................................................................................................................................................. 307
19.0 Charge Time Measurement Unit (CTMU) ............................................................................................................................... 319
20.0 SR Latch.................................................................................................................................................................................. 335
21.0 Fixed Voltage Reference (FVR) .............................................................................................................................................. 339
22.0 Digital-to-Analog Converter (DAC) .......................................................................................................................................... 341
23.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................ 345
24.0 Special Features of the CPU................................................................................................................................................... 351
25.0 Instruction Set Summary ......................................................................................................................................................... 369
26.0 Development Support.............................................................................................................................................................. 419
27.0 Electrical Characteristics ......................................................................................................................................................... 423
28.0 DC and AC Characteristics Graphs and Tables...................................................................................................................... 463
29.0 Packaging Information............................................................................................................................................................. 465
Appendix A: Revision History............................................................................................................................................................ 479
Appendix B: Device Differences ....................................................................................................................................................... 479
Index ................................................................................................................................................................................................. 481
The Microchip Web Site .................................................................................................................................................................... 491
Customer Change Notification Service ............................................................................................................................................. 485
Customer Support ............................................................................................................................................................................. 485
Reader Response ............................................................................................................................................................................. 492
Product Identification System ........................................................................................................................................................... 493
 2010 Microchip Technology Inc.
Device Overview ....................................................................................................................................................................... 13
Oscillator Module (With Fail-Safe Clock Monitor)...................................................................................................................... 27
Power-Managed Modes ............................................................................................................................................................ 47
Reset ......................................................................................................................................................................................... 59
Memory Organization ................................................................................................................................................................ 69
Flash Program Memory............................................................................................................................................................. 95
Data EEPROM Memory .......................................................................................................................................................... 105
8 x 8 Hardware Multiplier......................................................................................................................................................... 111
Interrupts ................................................................................................................................................................................. 113
Preliminary
PIC18(L)F2X/4XK22
DS41412A-page 11