FDY302NZ Fairchild Semiconductor, FDY302NZ Datasheet
FDY302NZ
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FDY302NZ Summary of contents
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... Thermal Characteristics Thermal Resistance, Junction-to-Ambient R θJA Thermal Resistance, Junction-to-Ambient R θJA Package Marking and Ordering Information Device Marking Device E FDY302NZ ©2006 Fairchild Semiconductor Corporation FDY302NZ Rev A ® ® ® ® Features • 600 mA 2.5V. GS • ESD protection diode (note 3) • RoHS Compliant =25 ...
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... Diode Reverse Recovery Charge rr Notes the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of θJA the drain pins guaranteed by design while R θJC a) FDY302NZ Rev 25°C unless otherwise noted A Test Conditions = 250 µ 250 µ ...
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... Figure 3. On-Resistance Variation with Temperature. 1 -55 A 1.2 0.9 0.6 0.3 0 0 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics. FDY302NZ Rev A 2.6 2 2.2 2.0V 2 1.8 1.6 1.4 1.2 1 0.8 0 0.75 1 Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 0.9 0.8 0.7 ...
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... D = 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 0.0001 0.001 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. FDY302NZ Rev A 100 15V rss 0 0.8 ...
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... NOTES: UNLESS OTHERWISE SPECIFIED A) THIS PACKAGE CONFORMS TO EIAJ SC89 PACKAGING STANDARD. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS. FDY302NZ Rev A 0.50 1.70 1.14 1.50 0.50 LAND PATTERN RECOMMENDATION 0.78 0.58 SEE DETAIL A ...
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... TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended exhaustive list of all such trademarks. Auto-SPM™ F-PFS™ Build it Now™ FRFET CorePLUS™ Global Power Resource CorePOWER™ ...