FDY302NZ Fairchild Semiconductor, FDY302NZ Datasheet - Page 2

• Manufacturer Part Number: FDY302NZ
• Description: MOSFET N-CH 20V SC-89-3
• Manufacturer: Fairchild Semiconductor
• Series: PowerTrench®r

Specifications of FDY302NZ

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 300 mOhm @ 600mA, 4.5V
• Drain To Source Voltage (vdss): 20V
• Current - Continuous Drain (id) @ 25° C: 600mA
• Vgs(th) (max) @ Id: 1.5V @ 250µA
• Gate Charge (qg) @ Vgs: 1.1nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 60pF @ 10V
• Power - Max: 446mW
• Mounting Type: Surface Mount
• Package / Case: SC-89-3, SOT-523F
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Notes:
1. R
FDY302NZ Rev A
Electrical Characteristics
Symbol
Off Characteristics
BV
∆BV
I
I
On Characteristics
V
∆V
R
g
Dynamic Characteristics
C
C
C
Switching Characteristics
t
t
t
t
Q
t
Q
Q
Q
Drain–Source Diode Characteristics and Maximum Ratings
V
the drain pins. R
DSS
GSS
d(on)
r
d(off)
f
rr
FS
GS(th)
SD
∆T
∆T
DS(on)
iss
oss
rss
θJA
g
gs
gd
rr
GS(th)
DSS
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
DSS
J
J
θJC
Drain–Source Breakdown
Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage,
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
Drain–Source Diode Forward
Voltage
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
is guaranteed by design while R
Parameter
(Note 2)
a)
(Note 2)
200°C/W when
mounted on a 1in
of 2 oz copper
θCA
is determined by the user's board design.
V
I
V
V
V
V
I
V
V
V
V
V
V
f = 1.0 MHz
V
V
V
V
V
I
dI
D
D
F
T
GS
DS
GS
GS
DS
GS
GS
GS
GS
DS
DS
DD
GS
DS
GS
GS
F
= 250 µA, Referenced to 25°C
= 600 mA,
2
= 250 µA, Referenced to 25°C
A
/dt = 100 A/µs
pad
= 25°C unless otherwise noted
= 0 V,
= 16 V,
= ± 12 V, V
= ± 4.5 V, V
= V
= 4.5 V,
= 2.5 V,
= 1.8 V,
= 4.5 V, I
= 5 V,
= 10 V,
= 4.5 V,
= 10 V,
= 10 V,
= 4.5 V
= 0 V,
Test Conditions
GS
,
I
D
S
=600mA, T
= 150 mA
I
V
I
I
I
I
I
V
I
R
I
D
D
D
D
D
D
D
D
GS
DS
DS
GEN
GS
= 250 µA
= 250 µA
= 600 mA
= 500 mA
= 150 mA
= 600 mA
= 1 A,
= 600 mA,
= 0 V
= 0 V
= 0 V
= 0 V,
= 6 Ω
J
(Note 2)
= 125°C
b) 280°C/W when mounted on a
2. Pulse Test: Pulse Width < 300µs,
3. The diode connected between the gate
Min
minimum pad of 2 oz copper
Duty Cycle < 2.0%
and source serves only as protection
againts ESD. No gate overvoltage
rating is implied.
0.6
Scale 1 : 1 on letter size paper
20
Typ
0.24
0.36
0.70
0.35
0.16
0.26
1.0
1.8
2.4
0.8
0.7
15
60
20
10
6
8
8
8
1
3
www.fairchildsemi.com
Max
± 10
0.30
0.50
1.20
1.00
± 1
1.5
4.8
1.1
1.2
12
16
16
1
Units
mV/°C
mV/°C
µA
µA
µA
nC
pF
pF
pF
nC
nC
nS
nC
ns
ns
ns
ns
V
Ω
V
S
V