A2F200M3F-1FGG484 Actel, A2F200M3F-1FGG484 Datasheet - Page 19

• Manufacturer Part Number: A2F200M3F-1FGG484
• Description: FPGA - Field Programmable Gate Array 200K System Gates SmartFusion
• Manufacturer: Actel

Specifications of A2F200M3F-1FGG484

• Processor Series: A2F200
• Core: ARM Cortex M3
• Number Of Logic Blocks: 8
• Maximum Operating Frequency: 120 MHz
• Number Of Programmable I/os: 161
• Data Ram Size: 4608 bit
• Delay Time: 200 ns
• Supply Voltage (max): 3.6 V
• Supply Current: 1 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: A2F-Eval-Kit, A2F-Dev-Kit, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.425 V
• Number Of Gates: 200000
• Package / Case: FPBGA-484
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thermal Characteristics
Introduction
The temperature variable in the SoC Products Group Designer software refers to the junction
temperature, not the ambient, case, or board temperatures. This is an important distinction because
dynamic and static power consumption will cause the chip's junction temperature to be higher than the
ambient, case, or board temperatures.
resistance, temperature gradient, and power.
where
Table 2-6 • Package Thermal Resistance
θ
θ
θ
T
T
T
T
P
Product
A2F200M3F-FG256
A2F200M3F-FG484
JA
JB
JC
A
J
B
C
= Junction-to-air thermal resistance
= Junction-to-board thermal resistance
= Junction-to-case thermal resistance
= Junction temperature
= Ambient temperature
= Board temperature (measured 1.0 mm away from the
= Case temperature
= Total power dissipated by the device
package edge)
X = 4.0; Y = 5.6
X = 5.10; Y = 7.3
Die Size
(mm)
EQ 1
R e v i s i o n 6
θ
θ
33.7
21.8
θ
Still Air
JB
JC
JA
through
=
=
=
T
------------------ -
T
------------------ -
T
----------------- -
J
J
J
P
–
P
–
P
–
30.0
18.2
1.0 m/s
θ
T
T
EQ 3
A
B
C
θ
JA
SmartFusion Intelligent Mixed Signal FPGAs
give the relationship between thermal
28.3
16.7
2.5 m/s
9.3
7.7
θ
JC
24.8
16.8
θ
JB
Units
°C/W
°C/W
EQ 1
EQ 2
EQ 3
2 -7