BUK6607-55C,118 NXP Semiconductors, BUK6607-55C,118 Datasheet - Page 4

MOSFET N-CH TRENCH D2PACK

BUK6607-55C,118

Manufacturer Part Number
BUK6607-55C,118
Description
MOSFET N-CH TRENCH D2PACK
Manufacturer
NXP Semiconductors
Series
TrenchMOS™r
Datasheet

Specifications of BUK6607-55C,118

Input Capacitance (ciss) @ Vds
5160pF @ 25V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
6.5 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
100A
Vgs(th) (max) @ Id
2.8V @ 1mA
Gate Charge (qg) @ Vgs
82nC @ 10V
Power - Max
158W
Mounting Type
Surface Mount
Package / Case
TO-263-3, D²Pak (2 leads + Tab), TO-263AB
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
7 mOhms
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
100 A
Power Dissipation
158 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free by exemption / RoHS compliant by exemption
NXP Semiconductors
BUK6607-55C
Product data sheet
Fig 1.
Fig 3.
(A)
(A)
I
I
D
D
10
10
10
120
100
10
80
60
40
20
-1
3
2
1
0
mounting base temperature
Continuous drain current as a function of
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
1
0
Limit R
(1)
DSon
50
= V
DS
/ I
D
100
150
All information provided in this document is subject to legal disclaimers.
T
003aaf081
mb
10
(°C)
DC
200
Rev. 1 — 14 October 2010
N-channel TrenchMOS logic and standard level FET
Fig 2.
P
(%)
der
120
80
40
0
function of mounting base temperature
Normalized total power dissipation as a
0
t
100 μ s
1 ms
10 ms
100 ms
p
=10 μ s
10
2
50
BUK6607-55C
100
V
DS
(V)
150
© NXP B.V. 2010. All rights reserved.
T
003aae890
mb
03na19
(°C)
10
200
3
4 of 14

Related parts for BUK6607-55C,118