BSC0908NS Infineon Technologies, BSC0908NS Datasheet - Page 3

MOSFET N-CH 34V 49A 8TDSON

BSC0908NS

Manufacturer Part Number
BSC0908NS
Description
MOSFET N-CH 34V 49A 8TDSON
Manufacturer
Infineon Technologies
Series
OptiMOS™r
Datasheet

Specifications of BSC0908NS

Input Capacitance (ciss) @ Vds
1220pF @ 15V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
8 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
34V
Current - Continuous Drain (id) @ 25° C
49A
Vgs(th) (max) @ Id
2.2V @ 250µA
Gate Charge (qg) @ Vgs
14nC @ 10V
Power - Max
30W
Mounting Type
Surface Mount
Package / Case
8-PowerTDFN
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
6.7 mOhms
Forward Transconductance Gfs (max / Min)
56 S, 28 S
Drain-source Breakdown Voltage
34 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
49 A
Power Dissipation
2.5 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BSC0908NSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BSC0908NS
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
2
at
Table 2
Parameter
Continuous drain current
Pulsed drain current
Avalanche current, single pulse
Avalanche energy, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2)
3
Table 3
Parameter
Thermal resistance, junction - case
Device on PCB
1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
Final Data Sheet
T
PCB is vertical in still air.
PCB is vertical in still air
j
See figure 3 for more detailed information
= 25 °C, unless otherwise specified.
Maximum ratings
Maximum ratings
Thermal characteristics
Thermal characteristics
2)
Symbol
R
R
Symbol
I
I
I
E
V
P
T
D
D,pulse
AS
thJC
thJA
j
AS
GS
tot
,T
stg
Min.
-
-
Min.
-
-
-
-
-20
-
-55
55
2
Typ.
-
-
Typ. Max.
-
-
-
-
-
-
-
150
2
2
Values
(one layer, 70 µm thick) copper area for drain connection.
Values
(one layer, 70 µm thick) copper area for drain connection.
49
31
39
25
14
196
35
10
20
30
2.5
150
56
Max.
4.2
20
50
OptiMOS™ Power-MOSFET
Unit
A
mJ
V
W
°C
Ncm
Unit
°K/W
Note / Test Condition
V
V
V
V
V
R
T
I
T
T
D
C
C
A
GS
GS
GS
GS
GS
thJA
=30 A,R
=25 °C
=25 °C
=25 °C, R
=10 V, T
=10 V, T
=4.5 V, T
=4.5 V, T
=10 V, T
Note /
Test Condition
bottom
top
=50 K/W
6 cm
GS
2
3.1, 2010-10-18
BSC0908NS
cooling area
=25
thJA
C
C
A
C
C
=25 °C
=100 °C
=25 °C,
1)
=25 °C
=100 °C
)
=50 K/W
1)
1)
)

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