EMD5DXV6T5G ON Semiconductor, EMD5DXV6T5G Datasheet
EMD5DXV6T5G
Specifications of EMD5DXV6T5G
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EMD5DXV6T5G Summary of contents
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... Reduces Component Count Available in 8 mm, 7 inch Tape and Reel Lead Free Solder Plating This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. Semiconductor Components Industries, LLC, 2003 July, 2003 − Rev. P1 http://onsemi ...
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MAXIMUM RATINGS ( unless otherwise noted, common for Q A Collector-Base Voltage Collector-Emitter Voltage Collector Current THERMAL CHARACTERISTICS (One Junction Heated) Total Device Dissipation Derate above 25 C Thermal Resistance (Both Junctions Heated) Total Device Dissipation Derate ...
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ELECTRICAL CHARACTERISTICS (T Characteristic Q1 TRANSISTOR: PNP OFF CHARACTERISTICS Collector-Base Cutoff Current ( Collector-Emitter Cutoff Current ( Emitter-Base Cutoff Current ( CHARACTERISTICS = 10 ...
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EMD5DXV6T1, EMD5DXV6T5 250 200 150 100 R = 833 C/W qJA 50 0 − AMBIENT TEMPERATURE ( C) A Figure 1. Derating Curve http://onsemi.com 4 100 150 ...
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TYPICAL ELECTRICAL CHARACTERISTICS — EMD5DXV6T1 PNP TRANSISTOR 0.1 0. COLLECTOR CURRENT (mA) C Figure 2. V versus I CE(sat ...
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TYPICAL ELECTRICAL CHARACTERISTICS — EMD5DXV6T1 NPN TRANSISTOR − 0.1 0. COLLECTOR CURRENT (mA) C Figure 6. V versus I CE(sat) 1 0.8 0.6 0.4 ...
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INFORMATION FOR USING THE SOT−563 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the to- tal design. The footprint for the semiconductor packages must be the correct size to ...
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... CATHODE 2 5. BASE 1 5. CATHODE 2 6. COLLECTOR 1 6. ANODE/ANODE 1 JAPAN: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. ...