EMD5DXV6T5G ON Semiconductor, EMD5DXV6T5G Datasheet - Page 7

• Manufacturer Part Number: EMD5DXV6T5G
• Description: TRANS BRT NPN/PNP DL 50V SOT-563
• Manufacturer: ON Semiconductor

Specifications of EMD5DXV6T5G

• Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 50V
• Resistor - Base (r1) (ohms): 4.7K, 47K
• Resistor - Emitter Base (r2) (ohms): 10K, 47K
• Dc Current Gain (hfe) (min) @ Ic, Vce: 80 @ 5mA, 10V / 20 @ 5mA, 10V
• Vce Saturation (max) @ Ib, Ic: 250mV @ 300µA, 10mA
• Current - Collector Cutoff (max): 500nA
• Power - Max: 500mW
• Mounting Type: Surface Mount
• Package / Case: SOT-563, SOT-6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Frequency - Transition: -

tal design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipa-
tion. Power dissipation for a surface mount device is deter-
mined by T
of the die, R
junction to ambient, and the operating temperature, T
ing the values provided on the data sheet for the SOT−563
package, P
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T
one can calculate the power dissipation of the device which
in this case is 150 milliwatts.
of the recommended footprint on a glass epoxy printed cir-
cuit board to achieve a power dissipation of 150 milliwatts.
There are other alternatives to achieving higher power dis-
sipation from the SOT−563 package. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad . Using a board material such
as Thermal Clad, an aluminum core board, the power dis-
sipation can be doubled using the same footprint.
Surface mount board layout is a critical portion of the to-
The power dissipation of the SOT−563 is a function of
The values for the equation are found in the maximum
The 833 C/W for the SOT−563 package assumes the use
INFORMATION FOR USING THE SOT−563 SURFACE MOUNT PACKAGE
P
D
J(max)
D
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
can be calculated as follows:
qJA
=
, the thermal resistance from the device
150 C − 25 C
, the maximum rated junction temperature
833 C/W
P
D
=
T
J(max)
R
qJA
= 150 milliwatts
− T
A
EMD5DXV6T1, EMD5DXV6T5
SOT−563 POWER DISSIPATION
0.0531
1.35
A
of 25 C,
http://onsemi.com
A
. Us-
0.0197
SOT−563
0.5
0.0118
0.3
0.0394
1.0
7
0.0197
0.5
SCALE 20:1
rated temperature of the device. When the entire device is
heated to a high temperature, failure to complete soldering
within a short time could result in device failure. There-
fore, the following items should always be observed in or-
der to minimize the thermal stress to which the devices are
subjected.
* Soldering a device without preheating can cause exces-
sive thermal shock and stress which can result in damage
to the device.
interface between the board and the package. With the cor-
rect pad geometry, the packages will self align when sub-
jected to a solder reflow process.
The melting temperature of solder is higher than the
ing should be 100 C or less.*
leads and the case must not exceed the maximum tem-
perature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering meth-
od, the difference shall be a maximum of 10 C.
260 C for more than 10 seconds.
mum temperature gradient shall be 5 C or less.
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
ing cooling.
Always preheat the device.
The delta temperature between the preheat and solder-
When preheating and soldering, the temperature of the
The soldering temperature and time shall not exceed
When shifting from preheating to soldering, the maxi-
After soldering has been completed, the device should
Mechanical stress or shock should not be applied dur-
0.0177
0.45
inches
mm
SOLDERING PRECAUTIONS