PIC18F14K22-E/ML Microchip Technology, PIC18F14K22-E/ML Datasheet - Page 387

• Manufacturer Part Number: PIC18F14K22-E/ML
• Description: 16KB Flash, 512bytes RAM, 256bytes EEPROM, 16MIPS, 1.8-5.5V Operation 20 QFN 4x4
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F14K22-E/ML

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 17
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2010 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Temperature
PIC18F13K22
PIC18LF13K22
E
I
ML
P
SO
SS
QTP, SQTP, Code or Special Requirements
(blank otherwise)
Range
X
=
=
=
=
= -40C to +125C
= -40C to
QFN
PDIP
SOIC
SSOP
(1)
(1)
, PIC18F14K22
, PIC18LF14K22
Package
/XX
+85C
(Extended)
(Industrial)
(1)
Pattern
,
XXX
Preliminary
PIC18F1XK22/LF1XK22
Examples:
a)
b)
c)
Note 1:
PIC18F14K22-E/P 301 = Extended temp.,
PDIP package, Extended V
tern #301.
PIC18LF14K22-E/SO = Extended temp., SOIC
package.
PIC18LF14K22-E/P = Extended temp., PDIP
package.
T
= in tape and reel PLCC, and TQFP
packages only.
.
DD
DS41365D-page 387
limits, QTP pat-