ISP1181BBS,551 NXP Semiconductors, ISP1181BBS,551 Datasheet - Page 63

• Manufacturer Part Number: ISP1181BBS,551
• Manufacturer: NXP Semiconductors

Specifications of ISP1181BBS,551

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / RoHS Status: Compliant

23. Package outline
Fig 34. TSSOP48 package outline.
ISP1181B_3
Product data sheet
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT362-1
48
1
Z
max.
y
1.2
A
pin 1 index
A
0.15
0.05
1
1.05
0.85
A
2
IEC
0.25
A
3
e
D
0.28
0.17
b
p
JEDEC
MO-153
0.2
0.2
0.1
0.1
c
REFERENCES
D
12.6
12.4
Rev. 03 — 23 January 2009
(1)
0
b
p
E
6.2
6.0
(2)
w
JEITA
scale
M
2.5
0.5
25
24
e
H
8.3
7.9
c
E
5 mm
1
L
A
2
A
1
L
0.8
0.4
p
Full-speed USB peripheral controller
0.50
0.35
Q
H
E
E
PROJECTION
0.25
EUROPEAN
detail X
v
L
L
0.08
p
w
© ST-NXP Wireless 2009. All rights reserved.
Q
ISP1181B
(A )
0.1
y
3
ISSUE DATE
A
99-12-27
03-02-19
0.8
0.4
Z
A
X
SOT362-1
v
M
8
0
o
o
62 of 72
A