STPCE1HEBC STMicroelectronics, STPCE1HEBC Datasheet - Page 56
STPCE1HEBC
Manufacturer Part Number
STPCE1HEBC
Description
Manufacturer
STMicroelectronics
Datasheet
1.STPCE1HEBC.pdf
(87 pages)
Specifications of STPCE1HEBC
Operating Temperature (min)
0C
Operating Temperature (max)
70C
Processing Unit
Microprocessor
Operating Supply Voltage (min)
2.45/3V
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
2.7/3.6V
Package Type
BGA
Screening Level
Commercial
Pin Count
388
Mounting
Surface Mount
Rad Hardened
No
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STPCE1HEBC
Manufacturer:
ST
Quantity:
20 000
MECHANICAL DATA
5.2. 388-PIN PACKAGE THERMAL DATA
The 388-pin PBGA package has a Power
Dissipation Capability of 4.5W. This increases to
6W when used with a Heatsink.
56/87
Board
Signal layers
Ambient
Case
Junction
Board
Ambient
Figure 5-5. Thermal Dissipation Without Heatsink
Rca
Rjc
Rjb
Rba
Figure 5-4. 388-Pin PBGA structure
Board
Release 1.3 - January 29, 2002
8.5
Rja = 13 °C/W
6
Junction
Ambient
Thermal balls
6
125
Case
The structure in shown in
Thermal dissipation options are illustrated in
Figure 5-5
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
Airflow = 0
Board temperature taken at the centrecentre ba
and
Figure
Power & Ground layers
5-6.
Figure
5-4.