SC2200UFH-300F 33 AMD (ADVANCED MICRO DEVICES), SC2200UFH-300F 33 Datasheet - Page 140

• Manufacturer Part Number: SC2200UFH-300F 33
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of SC2200UFH-300F 33

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

146
05h-07h
05h-06h
Offset
Offset
Offset
Offset
06h
07h
00h
01h
02h
03h
04h
05h
06h
07h
00h
01h
02h
03h
04h
00h
01h
02h
03h
04h
07h
Register
Register
Register
Register
RFRML(H)/
RFRML(L)/
RFRCC(H)
RFRCC(L)
RFRL(L)/
FRM_ST
RFRL(H)
MIR_PW
LSTFRC
SIR_PW
IRRXDC
IRTXMC
IRCFG1
IRCFG4
RCCFG
IRCR2
IRCR3
RSVD
RSVD
RSVD
Name
Name
SPR2
SPR3
Name
Name
BFPL
BSR
BSR
BSR
32580B
SHDM_DS
STRV_MS
R_LEN
RSVD
RSVD
BKSE
BKSE
BKSE
VLD
7
7
7
7
MCPW[2:0]
SHMD_DS
LOST_FR
IRRX_MD
DBW[2:0]
Table 5-59. Bank 4 Bit Map (Continued)
SFTSL
RSVD
T_OV
6
6
6
6
MBF[3:0]
RSVD
RSVD
Table 5-60. Bank 5 Bit Map
Table 5-61. Bank 6 Bit Map
Table 5-62. Bank 7 Bit Map
FEND_MD
IRSL0_DS
FIR_CRC
SIRC[2:0]
RXHSC
RSVD
5
5
5
5
RFRML[7:0] / RFRCC[7:0] (Low Byte Data)
RFRL[7:0] (Low Byte Data) / LSTFRC[7:0]
RFRL[15:8] (High Byte Data)
AUX_IRRX
RCDM_DS
MAX_LEN
MIR_CRC
RXINV
4
4
4
4
Scratchpad 2
Scratchpad 2
BSR[6:0] (Bank Select)
BSR[6:0] (Bank Select)
BSR[6:0] (Bank Select)
RSVD
RSVD
RSVD
Bits
RFRML[12:8] / RFRCC[12:8] (High Byte Data)
Bits
Bits
Bits
IRSL21_DS
PHY_ERR
TX_MS
RSVD
RSVD
IRID3
3
3
3
3
AMD Geode™ SC2200 Processor Data Book
TXCRC_INV TXCRC_DS
BAD_CRC
MCFR[4:0]
DFR[4:0]
TXHSC
MDRS
2
2
2
2
MPW[3:0]
SPW[3:0]
FPL[3:0]
IRIC[2:0]
IRMSSL
OVR1
RSVD
1
1
1
1
RC_MMD[1:0]
SuperI/O Module
IR_FDPLX
OVR2
RSVD
0
0
0
0