SC2200UFH-300F 33 AMD (ADVANCED MICRO DEVICES), SC2200UFH-300F 33 Datasheet - Page 390

• Manufacturer Part Number: SC2200UFH-300F 33
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of SC2200UFH-300F 33

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Notes:
1)
2)
408
IDE_CS[1:0]#
IDE_DATA[15:0]
IDE_DATA[15:0]
IDE_DREQ0
IDE_DACK0#
IDE_IOR0#
IDE_IOW0#
For Multiword DMA transfers, the Device may negate IDE_DREQ[0:1] within the tL specified time once IDE_DACK[0:1
is asserted, and reassert it again at a later time to resume the DMA operation. Alternatively, if the device is able to co
tinue the transfer of data, the device may leave IDE_DREQ[0:1] asserted and wait for the host to reasse
IDE_DACK[0:1]#.
This signal can be negated by the host to Suspend the DMA transfer in process.
32580B
Figure 9-26. Multiword DMA Data Transfer Timing Diagram
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AMD Geode™ SC2200 Processor Data Book
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Electrical Specifications