SC2200UFH-300 AMD (ADVANCED MICRO DEVICES), SC2200UFH-300 Datasheet - Page 133

• Manufacturer Part Number: SC2200UFH-300
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of SC2200UFH-300

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

SuperI/O Module
1.
2.
3.
4.
5.
AMD Geode™ SC2200 Processor Data Book
Offset
00h
01h
02h
03h
04h
05h
06h
07h
Non-Extended Mode.
Extended Mode.
In SP1 only.
In SP2 only.
When bit 7 of this register is set to 1, bits [6:0] of BSR select the bank, as shown in Table 5-38 on page 139.
04h-07h
Offset
00h
01h
02h
03h
Register
ASCR
Name
MCR
MCR
BSR
SPR
LCR
MSR
RXD
IER
IER
EIR
EIR
FCR
TXD
LSR
1
2
1
2
5
5
1
1
2
2
Type
R/W
RO
RO
RO
---
ER_INF
RSVD
BKSE
BKSE
DCD
7
RXFTH[1:0]
FEN[1:0]
RSVD
RSVD
Name
MRID. Module and Revision ID
SH_LCR. Shadow of LCR
SH_FCR. Shadow of FIFO Control
BSR. Bank Select
RSVD. Reserved
TXEMP
TXUR
SBRK
RSVD
RI
6
Table 5-41. Bank 3 Register Map
4
Table 5-42. Bank 0 Bit Map
RSVD
RSVD
TXEMP_EV
TXEMP_IE
RXACT
TXRDY
STKP
DSR
5
TXFTH[1:0]
4
RSVD
TXD[7:0] (Transmitter Data Bits)
RXD[7:0] (Receiver Data Bits)
DMA_EV
DMA_IE
RXWDG
RSVD
RSVD
LOOP
EPS
BRK
CTS
4
Scratch Data
3
BSR[6:0] (Bank Select)
3
/
/
4
4
4
Bits
TX_DFR
MS_EV
ISEN or
DCDLP
MS_IE
MS_IE
DDCD
RSVD
RSVD
RXFT
PEN
FE
3
TXHLT_EV
LS_EV or
S_OET
RSVD
LS_IE
LS_IE
TXSR
IPR1
RILP
TERI
STB
PE
2
32580B
4
TXLDL_EV RXHDL_EV
TXLDL_IE
TXLDL_IE
RXSR
DDSR
RSVD
IPR0
RTS
RTS
OE
1
WLS[1:0]
RXF_TOUT
RXHDL_IE
RXHDL_IE
FIFO_EN
RXDA
DCTS
DTR
DTR
IPF
0
139