SC2200UFH-300 AMD (ADVANCED MICRO DEVICES), SC2200UFH-300 Datasheet - Page 352

• Manufacturer Part Number: SC2200UFH-300
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of SC2200UFH-300

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

9.1.4
Table 9-3 lists the various power supplies of the SC2200 and provides the device operating conditions.-
Note 1. For V
Notes:
1)
2)
3)
370
Symbol
(Note 1)
T
AV
AV
V
V
V
V
V
V
V
V
C
BAT
IO
CORE
PLL2
PLL3
SB
SBL
CCCRT
CCUSB
CCCRT
All power sources except V
even if the function is not used.
V
applied. V
rately. See Section 9.3.15 "Power-Up Sequencing" on
page 439.
The power planes of the SC2200 can be turned on or
off. For more information, see Section 6.2.9 "Power
Management Logic" on page 166.
SB
erating conditions refer to Section 9.2 "DC Characteristics" on page 379.
and V
Operating Conditions
IH
Parameter
Operating case temperature
Analog power supply. Powers internal analog cir-
cuits and some external signals (see Table 9-4).
Battery supply voltage. Powers RTC and ACPI
when V
and some external signals (see Table 9-4).
I/O buffer power supply. Powers most of the
external signals (see Table 9-4); certain signals
within this power plane are 5V tolerant.
Core processor and internal digital power supply. Powers internal digital logic, including internal frequency
multipliers.
233 or 266 MHz
300 MHz
PLL. Internal Phase Locked Loops (PLLs) power
supply.
Standby power supply. Powers RTC and ACPI
when V
external signals (see Table 9-4).
Standby logic. Powers internal logic needed to support Standby V
itor to V
233 or 266 MHz
300 MHz
CRT DAC. Powers CRT DAC digital circuits.
233 or 266 MHz
300 MHz
SB
SBL
(Input High Voltage), V
and V
must be on if any other voltage is
BAT
SB
SS
32580B
BAT
.
is greater than V
is greater than V
voltages can be applied sepa-
BAT
must be connected,
IL
(Input Low Voltage), I
BAT
Table 9-3. Operating Conditions
SB
-0.5V, and some
(by at least 0.5V),
OH
4)
5)
(Output High Current), and I
3.14
3.14
1.71
1.99
3.14
3.14
1.71
1.99
1.71
1.99
Min
2.4
It is recommended that the voltage difference between
V
to reduce leakage current. If the voltage difference
exceeds 0.25V, excessive leakage current is used in
gates that are connected on the boundary between
voltage domains.
It is recommended that the voltage difference between
V
leakage current. If the voltage difference exceeds
0.25V, excessive leakage current is used in gates that
are connected on the boundary between voltage
domains.
0
CCCRT
IO
and V
, V
Typ
3.3
3.0
3.3
1.8
2.1
3.3
3.3
1.8
2.1
1.8
2.1
CORE
SB
-
AMD Geode™ SC2200 Processor Data Book
SB
be less than 0.25V, in order to reduce
. V
and V
SBL
Max
3.46
3.46
3.46
1.89
2.21
3.46
3.46
1.89
2.21
1.89
2.21
85
requires a 0.1 µF bypass capac-
SBL
OL
be less than 0.25V, in order
Unit
(Output Low Current) op-
o
V
V
V
V
V
V
V
V
V
V
V
C
Electrical Specifications
Comments