HI7188IN Intersil, HI7188IN Datasheet - Page 23
![CONV A/D 16BIT 8:1 MUX 44-MQFP](/photos/28/17/281750/44-mqfp_sml.jpg)
HI7188IN
Manufacturer Part Number
HI7188IN
Description
CONV A/D 16BIT 8:1 MUX 44-MQFP
Manufacturer
Intersil
Datasheet
1.HI7188IN.pdf
(24 pages)
Specifications of HI7188IN
Number Of Bits
16
Sampling Rate (per Second)
240
Data Interface
QSPI™, Serial, SPI™
Number Of Converters
1
Power Dissipation (max)
50mW
Voltage Supply Source
Analog and Digital, Dual ±
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
44-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
SUBSTRATE POTENTIAL:
Metallization Mask Layout
215 mils x 257 mils
(5466 m x 6536 m)
Type: AlSiCu
Thickness:Metal 2 16k
Metal 1 6k
AV
SS
Å
Å
23
HI7188
HI7188
PASSIVATION:
WORST CASE CURRENT DENSITY:
PROCESS:
Type: Sandwich
Nitride Thickness: 8k
USG Thickness: 1k
<2.0 x 10
HBCIO
5
A/cm
2
Å
Å