EP2SGX130GF1508I4N Altera, EP2SGX130GF1508I4N Datasheet - Page 139

• Manufacturer Part Number: EP2SGX130GF1508I4N
• Description: IC STRATIX II GX 130K 1508-FBGA
• Manufacturer: Altera
• Series: Stratix® II GXr

Specifications of EP2SGX130GF1508I4N

• Number Of Logic Elements/cells: 132540
• Number Of Labs/clbs: 6627
• Total Ram Bits: 6747840
• Number Of I /o: 734
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 1508-FBGA
• Family Name: Stratix II GX
• Number Of Logic Blocks/elements: 132540
• # I/os (max): 734
• Frequency (max): 732.1MHz
• Process Technology: SRAM
• Operating Supply Voltage (typ): 1.2V
• Logic Cells: 132540
• Ram Bits: 6747840
• Operating Supply Voltage (min): 1.15V
• Operating Supply Voltage (max): 1.25V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 1508
• Package Type: FC-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 544-2175

Altera Corporation
October 2007
Note to
(1)
Series termination with
calibration
Differential termination
Table 2–34. On-Chip Termination Support by I/O Banks (Part 2 of 2)
On-Chip Termination Support
Clock pins CLK1 and CLK3, and pins FPLL[7..8]CLK do not support differential on-chip termination. Clock pins
CLK0 and CLK2, do support differential on-chip termination. Clock pins in the top and bottom banks (CLK[4..7,
12..15]) do not support differential on-chip termination.
Table
2–34:
f
(1)
Differential On-Chip Termination
Stratix II GX devices support internal differential termination with a
nominal resistance value of 100 for LVDS input receiver buffers. LVPECL
input signals (supported on clock pins only) require an external
termination resistor. Differential on-chip termination is supported across
the full range of supported differential data rates, as shown in the
High-Speed I/O Specifications section of the
chapter in volume 1 of the Stratix II GX Device Handbook.
For more information on differential on-chip termination, refer to the
High-Speed Differential I/O Interfaces with DPA in Stratix II & Stratix II GX
Devices
3.3-V LVTTL
3.3-V LVCMOS
2.5-V LVTTL
2.5-V LVCMOS
1.8-V LVTTL
1.8-V LVCMOS
1.5-V LVTTL
1.5-V LVCMOS
SSTL-2 class I and II
SSTL-18 class I and II
1.8-V HSTL class I
1.8-V HSTL class II
1.5-V HSTL class I
1.2-V HSTL
LVDS
HyperTransport technology
I/O Standard Support
chapter in volume 2 of the Stratix II GX Device Handbook.
Top and Bottom Banks
Stratix II GX Device Handbook, Volume 1
(3, 4, 7, 8)
v
v
v
v
v
v
v
v
v
v
v
v
v
v
—
—
DC & Switching Characteristics
Stratix II GX Architecture
Left Bank (1, 2)
v
v
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2–131