FIN212ACGFX Fairchild Semiconductor, FIN212ACGFX Datasheet - Page 13

• Manufacturer Part Number: FIN212ACGFX
• Description: IC SER/DESER 12BIT 42USS-BGA
• Manufacturer: Fairchild Semiconductor
• Series: SerDes™r

Specifications of FIN212ACGFX

• Function: Serializer/Deserializer
• Data Rate: 560Mbps
• Input Type: LVCMOS
• Output Type: LVCMOS
• Number Of Inputs: 12
• Number Of Outputs: 12
• Voltage - Supply: 1.65 V ~ 3.6 V
• Operating Temperature: -30°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 42-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: FIN212ACGFXTR

Tape and Reel Specifications
BGA Embossed Tape Dimensions
Notes:
A
requirements (see sketches A, B, and C).
BGA Shipping Reel Dimensions
© 2008 Fairchild Semiconductor Corporation
FIN212AC • Rev. 1.1.0
Tape Width
Package
0
3.5 x 4.5
, B
12
16
8
0
, and K
Tc
0
±0.1
T
3.85
K
Sketch A (Side or Front Sectional View)
A
0
10° maximum component rotation
dimensions are determined with respect to the EIA/JEDEC RS-481 rotational and lateral movement
Dia A
330.0
330.0
330.0
0
Max.
Component Rotation
Dia A
max
W
c
±0.1
4.80
B
0
B
Dim B
Min.
0
1.5
1.5
1.5
±0.5
1.55
D
(Continued)
Min.
1.50
+0.5/-0.2
D
Dia C
1
Figure 9. BGA Tape and Reel
W2 max Measured at Hub
13.0
13.0
13.0
Component Rotation
A
B0
0
±0.1
1.75
E
Sketch B (Top View)
A0
See detailAA
P
0
10° maximum
±0.1
5.50
Dia D
F
Min.
20.2
20.2
20.2
Dia N
13
Typical component
cavity center line
Typical component
center line
P
1
±0.1
1.10
K
D
0
D
1
W3
W1 Measured at Hub
Typ.
8.00
Dim N
178.0.
178.0.
178.0.
P
Min.
Component Lateral Movement
1
Dia D
min
1.0mm
maximum
Typ.
4.00
P
User Direction of Feed
Sketch C (Top View)
0
B Min
DETAIL AA
Dim W1
+2.0/-0
±0.5
2.00
12.4
16.4
P
8.4
P
2
2
1.0mm
maximum
F
Dia C
E
Typ.
0.30
T
Dim W2
14.4
18.4
22.4
±0/05
W
0.07
T
C
www.fairchildsemi.com
12.00
±0.3
W
11.9 ~ 15.4
15.9 ~ 19.4
(LSL-USL)
7.9 ~ 10.4
Dim W3
Typ.
W
9.3
C