TDF8555J NXP Semiconductors, TDF8555J Datasheet - Page 53

• Manufacturer Part Number: TDF8555J
• Description: The TDF8555J is one of a new generation of complementary quad Bridge-Tied Load(BTL) audio power amplifiers with full I²C-bus controlled diagnostics, multiple voltageregulator and two power switches intended for automotive applications
• Manufacturer: NXP Semiconductors

NXP Semiconductors
17. Soldering of through-hole mount packages
TDF8555J
Product data sheet
17.1 Introduction to soldering through-hole mount packages
17.2 Soldering by dipping or by solder wave
17.3 Manual soldering
17.4 Package related soldering information
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Table 28.
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 September 2011
4 45 W power amplifier with multiple voltage regulator
Soldering method
Dipping
-
suitable
-
Wave
suitable
suitable
not suitable
TDF8555J
stg(max)
© NXP B.V. 2011. All rights reserved.
[1]
). If the
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