TDF8555J NXP Semiconductors, TDF8555J Datasheet - Page 57

• Manufacturer Part Number: TDF8555J
• Description: The TDF8555J is one of a new generation of complementary quad Bridge-Tied Load(BTL) audio power amplifiers with full I²C-bus controlled diagnostics, multiple voltageregulator and two power switches intended for automotive applications
• Manufacturer: NXP Semiconductors

NXP Semiconductors
22. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.4.1
7.4.2
7.4.3
7.4.4
7.4.5
7.5
7.5.1
7.5.2
7.5.3
7.5.4
7.6
7.7
7.8
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
9
9.1
9.2
10
11
12
13
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
Functional description amplifier section. . . . . 9
Functional description voltage regulator
section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
I
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 33
Thermal characteristics . . . . . . . . . . . . . . . . . 34
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 35
Performance diagrams . . . . . . . . . . . . . . . . . . 44
2
C-bus specification . . . . . . . . . . . . . . . . . . . . 25
Engine start and low voltage operation. . . . . . 10
Output protection and short-circuit protection. 12
Loss-of-ground/loss of V
Overvoltage warning and load dump
protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Thermal pre-warning and thermal protection . 14
Start-up diagnostics with DC load detection . . 15
Line driver mode and low gain mode . . . . . . . 20
I
I
I
I
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
Start-up and shut-down timing . . . . . . . . . . . . . 9
POR behavior . . . . . . . . . . . . . . . . . . . . . . . . . 11
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Speaker fault detection . . . . . . . . . . . . . . . . . . 13
Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DC offset detection . . . . . . . . . . . . . . . . . . . . . 18
AC load detection . . . . . . . . . . . . . . . . . . . . . 18
Distortion (clip-) detection . . . . . . . . . . . . . . . . 20
after read . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Switched regulator outputs . . . . . . . . . . . . . . . 22
Standby regulator outputs. . . . . . . . . . . . . . . . 22
Bus controller regulator output . . . . . . . . . . . . 22
Backup capacitor . . . . . . . . . . . . . . . . . . . . . . 22
Backup function . . . . . . . . . . . . . . . . . . . . . . . 23
Power switches. . . . . . . . . . . . . . . . . . . . . . . . 23
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Temperature protection. . . . . . . . . . . . . . . . . . 24
2
2
2
2
C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
C-bus diagnostic bits read out/cleared
C-bus instruction bytes. . . . . . . . . . . . . . . . . 26
C-bus data bytes . . . . . . . . . . . . . . . . . . . . . 30
P
failure . . . . . . . . . . 12
4 45 W power amplifier with multiple voltage regulator
14
14.1
14.2
14.3
14.4
14.4.1
15
15.1
16
17
17.1
17.2
17.3
17.4
18
19
20
20.1
20.2
20.3
20.4
21
22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Application information . . . . . . . . . . . . . . . . . 48
Test information . . . . . . . . . . . . . . . . . . . . . . . 51
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 52
Soldering of through-hole mount packages. 53
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 54
Revision history . . . . . . . . . . . . . . . . . . . . . . . 54
Legal information . . . . . . . . . . . . . . . . . . . . . . 55
Contact information . . . . . . . . . . . . . . . . . . . . 56
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Application PCB layout . . . . . . . . . . . . . . . . . 49
Beep input circuit . . . . . . . . . . . . . . . . . . . . . . 50
Regulator output noise. . . . . . . . . . . . . . . . . . 50
Regulator stability . . . . . . . . . . . . . . . . . . . . . 50
Example regulator 2. . . . . . . . . . . . . . . . . . . . 51
Quality information . . . . . . . . . . . . . . . . . . . . . 51
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Soldering by dipping or by solder wave . . . . . 53
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 53
Package related soldering information. . . . . . 53
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 55
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Date of release: 15 September 2011
TDF8555J
Document identifier: TDF8555J
All rights reserved.