m36l0t7060b2 STMicroelectronics, m36l0t7060b2 Datasheet - Page 20

• Manufacturer Part Number: m36l0t7060b2
• Description: 128 Mbit Multiple Bank, Multilevel, Burst Flash Memory And 64 Mbit 4 Mb X16 Psram, Multichip Package
• Manufacturer: STMicroelectronics

Part numbering
7
20/22
Part numbering
Table 7.
Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of
available options (Speed, Package, etc.) or for further information on any aspect of this
device, please contact the STMicroelectronics Sales Office nearest to you.
Example:
Device Type
M36 = Multichip package (Flash + RAM)
Flash 1 Architecture
L = Multilevel, Multiple Bank, Burst mode
Flash 2 Architecture
0 = No Die
Operating Voltage
T = V
Flash 1 Density
7 = 128 Mbit
Flash 2 Density
0 = No Die
RAM 1 Density
6 = 64 Mbit
RAM 0 Density
0 = No Die
Parameter Blocks Location
T = Top Boot Block Flash
B = Bottom Boot Block Flash
Product Version
2 = 90 nm Flash technology and Multilevel design, 85 ns speed; 0.13 µm RAM, 65 ns
speed
Package
ZAQ = Stacked TFBGA88 8x10 mm - 8x10 active ball array, 0.8 mm pitch
Option
Blank = Standard Packing
T = Tape & Reel Packing
E = ECOPACK® package, standard packing
F = ECOPACK® package, tape and reel packing
DDF
= 1.7 to 2.0 V; V
Ordering information scheme
DDQ
= V
CCP
= 2.7 to 3.5 V
M36 L 0 T
7 0 6 0 T 2
M36L0T7060T2, M36L0T7060B2
ZAQ F