mt16htf25664ay-80e Micron Semiconductor Products, mt16htf25664ay-80e Datasheet
mt16htf25664ay-80e
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mt16htf25664ay-80e Summary of contents
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... R/Cs B and E) 2 ≤ +70°C) A ≤ +85° Contact Micron for industrial temperature module offerings. 3. Available only in 2GB, Rev. E devices. 4. Not available in 512MB, 4GB module density. 5. Not recommended for new designs RCD (ns) (ns) – – 13.125 13.125 533 – ...
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... MT16HTF12864AY-800__ MT16HTF12864AY-667__ MT16HTF12864AY-53E__ MT16HTF12864AY-40E__ Table 5: Part Numbers and Timing Parameters – 2GB Modules Base device: MT47H128M8, Module 2 Part Number Density MT16HTF25664AY-80E__ MT16HTF25664AY-800__ MT16HTF25664AY-667__ MT16HTF25664AY-53E__ MT16HTF25664AY-40E__ Table 6: Part Numbers and Timing Parameters – 4GB Modules Base device: MT47H256M8, Module 2 Part Number Density ...
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Pin Assignments and Descriptions Table 7: Pin Assignments 240-Pin UDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ19 61 REF ...
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... Edge-aligned with read data, center-aligned with write data. DQS# is only used when differential data strobe mode is enabled via the LOAD MODE command. SDA I/O Serial presence-detect data: SDA is a bidirectional pin used to transfer addresses and data into and out of the presence-detect portion of the module Supply Power supply: 1.8V ± ...
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Functional Block Diagrams Figure 2: Functional Block Diagram (-1GA, -80E, -800, -667, -53E, -40E) – Raw Card E S1# S0 DQS0 DQS0 DM0 DM CS# DQS DQS# DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 ...
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Figure 3: Functional Block Diagram (-53E, -40E) – Raw Card B S1# S0 DQS0 DQS0 DM0 DM CS# DQS DQS# DQ0 DQ DQ1 DQ DQ2 DQ DQ3 DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQ ...
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... DDR2 SDRAM modules incorporate serial presence-detect (SPD). The SPD function is implemented using a 2,048-bit EEPROM. This nonvolatile storage device contains 256 bytes. The first 128 bytes are programmed by Micron to identify the module type and various SDRAM organizations and timing parameters. The remaining 128 bytes of storage are available for use by the customer ...
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... Electrical Specifications Stresses greater than those listed in Table 9 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated in the device data sheet are not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability ...
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... HIGH HIGH between valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching Notes: 1. Value calculated as one module rank in this operating condition; all other module ranks Value calculated reflects all module ranks in this operating condition. ...
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... HIGH HIGH between valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching Notes: 1. Value calculated as one module rank in this operating condition; all other module ranks Value calculated reflects all module ranks in this operating condition. ...
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... S# is HIGH between valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching Notes: 1. Value calculated as one module rank in this operating condition; all other module ranks Value calculated reflects all module ranks in this operating condition. ...
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Table 14: DDR2 I Specifications and Conditions (Die Revision E) – 2GB DD Values are shown for the MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet Parameter/Condition Operating ...
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... Notes: 1. Value calculated as one module rank in this operating condition; all other module ranks Value calculated reflects all module ranks in this operating condition. PDF: 09005aef80f09084/Source: 09005aef80f09068 HTF16C64_128_256x64A.fm - Rev. F 8/07 EN 512MB, 1GB, 2GB, 4GB (x64, DR) 240-Pin DDR2 SDRAM UDIMM 2P (CKE LOW) mode. ...
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... DD valid commands; Address bus inputs are stable during deselects; Data bus inputs are switching Notes: 1. Value calculated as one module rank in this operating condition; all other module ranks Value calculated reflects all module ranks in this operating condition. PDF: 09005aef80f09084/Source: 09005aef80f09068 HTF16C64_128_256x64A ...
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Serial Presence-Detect Table 16: Serial Presence-Detect EEPROM DC Operating Conditions Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage 3mA OUT Input leakage current GND ...
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... Number of SPD bytes used by Micron 1 Total number of bytes in SPD device 2 Fundamental memory type 3 Number of row addresses on SDRAM 4 Number of column addresses on SDRAM 5 DIMM height and module ranks 6 Module data width 7 Reserved 8 Module voltage interface levels t 9 SDRAM cycle time, CK (CL = MAX value, see byte 18) ...
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... SDRAM access from CK, 27 MIN row precharge time, 28 MIN row active-to-row active, 29 MIN RAS#-to-CAS# delay, 30 MIN active-to-precharge time, 31 Module rank density 32 Address and command setup time, 33 Address and command hold time, 34 Data/data mask input setup time, 35 Data/data mask input hold time, t ...
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... SPD revision 63 Checksum for bytes 0–62 ECC/ECC and parity 64 Manufacturer’s JEDEC ID code 65–71 Manufacturer’s JEDEC ID code 72 Manufacturing location 73–90 Module part number (ASCII) 91 PCB identification code 92 PCB identification code (continued) 93 Year of manufacture in BCD 94 Week of manufacture in BCD 95–98 Module serial number 99– ...
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... TYP TYP 123.0 (4.84) TYP Back view U12 U13 U14 U15 5.0 (0.197) TYP 63.0 (2.48) TYP 19 Module Dimensions U7 U8 30.50 (1.2) 29.85 (1.175) 17.78 (0.7) TYP 10.0 (0.394) TYP Pin 120 U16 U17 Pin 121 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2003 Micron Technology, Inc. All rights reserved. ...
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... TYP Back view U13 U14 U16 U17 5.0 (0.197) TYP 63.0 (2.48) TYP ® their respective owners. characterization sometimes occur. 20 Module Dimensions U8 U9 30.50 (1.2) 29.85 (1.175) 17.78 (0.7) TYP 10.0 (0.394) TYP Pin 120 U18 U19 Pin 121 Micron Technology, Inc., reserves the right to change products or specifications without notice. ...