hx6256 Honeywell International's Solid State Electronics Center (SSEC), hx6256 Datasheet - Page 10

• Manufacturer Part Number: hx6256
• Description: 32k X 8 Static Ram Solid State Electronics Center
• Manufacturer: Honeywell International's Solid State Electronics Center (SSEC)

HX6256
TESTER AC TIMING CHARACTERISTICS
QUALITY AND RADIATION HARDNESS
ASSURANCE
Honeywell maintains a high level of product integrity
through process control, utilizing statistical process
control, a complete “Total Quality Assurance System,” a
computer data base process performance tracking
system, and a radiation- hardness assurance strategy.
The radiation hardness assurance strategy starts with a
technology that is resistant to the effects of radiation.
Radiation hardness is assured on every wafer by
irradiating test structures as well as SRAM product, and
then monitoring key parameters which are sensitive to
ionizing radiation. Conventional MIL-STD-883 TM 5005
Group E testing, which includes total dose exposure with
Cobalt 60, may also be performed as required. This
Total Quality approach ensures our customers of a
reliable product by engineering in reliability, starting with
process development and continuing through product
qualification and screening.
SCREENING LEVELS
Honeywell offers several levels of device screening to
meet your system needs. “Engineering Devices” are
available with limited performance and screening for
breadboarding and/or evaluation testing. Hi-Rel Level B
and S devices undergo additional screening per the
requirements of MILSTD-883. As a QML supplier,
Honeywell also offers QML Class Q and V devices per
MIL-PRF-38535 and are available per the applicable
Standard Microcircuit Drawing (SMD). QML devices offer
ease of procurement by eliminating the need to create
detailed specifications and offer benefits of improved
quality and cost savings through standardization.
10
* Input rise and fall times <1 ns/V
RELIABILITY
Honeywell
requirements for space and defense systems and has
extensive experience in reliability testing on programs of
this
comprehensive testing of VLSI processes. Reliability
attributes of the RICMOS
by testing specially designed irradiated and non-
irradiated test structures from which specific failure
mechanisms
mechanisms included, but were not limited to, hot
carriers, electromigration and time dependent dielectric
breakdown. This data was then used to make changes
to the design models and process to ensure more
reliable products.
In addition, the reliability of the RICMOS
product in a military environment was monitored by
testing
accelerated dynamic life test conditions. Packages are
qualified for product use after undergoing Groups B & D
testing as outlined in MIL-STD-883, TM 5005, Class S.
The product is qualified by following a screening and
testing flow to meet the customer’s requirements. Quality
conformance testing is performed as an option on all
production lots to ensure the ongoing reliability of the
product.
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