ADSP-TS202S_06 AD [Analog Devices], ADSP-TS202S_06 Datasheet - Page 40

• Manufacturer Part Number: ADSP-TS202S_06
• Description: TigerSHARC Embedded Processor
• Manufacturer: AD [Analog Devices]

ADSP-TS202S
ENVIRONMENTAL CONDITIONS
The ADSP-TS202S processor is rated for performance under
T
ditions on Page
Thermal Characteristics
The ADSP-TS202S processor is packaged in a 25 mm × 25 mm,
thermally enhanced ball grid array (BGA_ED). The
ADSP-TS202S processor is specified for a case temperature
(T
exceeded, a heat sink and/or an air flow source may be required.
Table 34
25 mm × 25 mm BGA_ED package. All parameters are based on
a JESD51-9 four-layer 2s2p board. All data are based on 3 W
power dissipation.
Table 34. Thermal Characteristics for 25 mm × 25 mm
Package
1
2
3
4
Parameter
θ
θ
θ
θ
θ
θ
θ
CASE
mounted boards, use 17.0°C/W for 0 m/s.
JA
JB
JC
JA
JA
JB
JC
CASE
3
4
1
measured per JEDEC standard JESD51-9.
measured by cold plate test method (no approved JEDEC standard).
measured per JEDEC standard JESD51-6.
= 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally
environmental conditions specified in the
). To ensure that the T
shows the thermal characteristics of the
21.
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 3 m/s
—
—
CASE
data sheet specification is not
Typical
12.9
10.2
9.0
8.0
7.7
0.7
2
Operating Con-
Rev. C | Page 40 of 48 | December 2006
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W