ADSP-TS202S_06 AD [Analog Devices], ADSP-TS202S_06 Datasheet - Page 45

• Manufacturer Part Number: ADSP-TS202S_06
• Description: TigerSHARC Embedded Processor
• Manufacturer: AD [Analog Devices]

OUTLINE DIMENSIONS
The ADSP-TS202S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
SURFACE MOUNT DESIGN
Table 36
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 36. BGA Data for Use with Surface Mount Design
Package
576-Ball BGA_ED
(BP-576)
is provided as an aid to PCB design. For industry-
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GR ID IS W ITHIN 0.25 m m OF ITS
3. CENTER DIMENSIONS ARE N OMINAL.
4. THIS PACKAGE C ONFORMS TO JEDEC MS-034 SPECIFICATION.
IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.
3.10
2.94
2.78
1.25
1.00
0.75
1.25
1.00
0.75
Ball Attach Type
Nonsolder Mask Defined (NSMD)
A1 BALL
INDICATOR
TOP VIEW
25.20
25.00
24.80
Rev. C | Page 45 of 48 | December 2006
Figure 47. 576-Ball BGA_ED (BP-576)
25.20
25.00
24.80
DETAIL A
Solder Mask Opening
0.69 mm diameter
23.00
BSC
SQ
SEATING PLANE
BSC
1.00
1.00
BSC
PITCH)
(BALL
0.97 BSC
BSC
1.00
24 22
23
21 19
20
18
DETAIL A
BOTTOM VIEW
17
16
15
14
13
DIAMETER)
12
11
Ball Pad Size
0.56 mm diameter
(BALL
10
0.75
0.65
0.55
9
8
7
6
5
4
1.60 MAX
0.20 MAX
3
ADSP-TS202S
2
0.60
0.50
0.40
1
B
D
F
H
K
M
P
T
V
Y
AB
AD
A
C
E
G
J
L
N
R
U
W
AA
AC