MK61FN1M0VMD12 FREESCALE [Freescale Semiconductor, Inc], MK61FN1M0VMD12 Datasheet - Page 25

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MK61FN1M0VMD12

Manufacturer Part Number
MK61FN1M0VMD12
Description
K61 Sub-Family Data Sheet
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet

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Part Number
Manufacturer
Quantity
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Part Number:
MK61FN1M0VMD12
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1.
2.
3.
4.
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 Debug trace timing specifications
Freescale Semiconductor, Inc.
Four-layer (2s2p)
Single-layer (1s)
Four-layer (2s2p)
Board type
Symbol
T
cyc
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
Clock period
Description
R
R
R
R
R
Ψ
Symbol
θJA
θJMA
θJMA
θJB
θJC
JT
K61 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Table 12. Debug trace operating behaviors
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to board
Thermal
resistance, junction
to case
Thermal
characterization
parameter, junction
to package top
outside center
(natural
convection)
Description
Table continues on the next page...
Preliminary
30
41
27
17
10
2
144 MAPBGA
Peripheral operating requirements and behaviors
Frequency dependent
Min.
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Max.
1
1
1
2
3
4
Notes
MHz
Unit
25

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